Search results for "Master Bond"
Nozzle tech provides improved cleaning performance
acp systems launches innovative nozzle technology for CO2 snow jet cleaning Improved cleaning performance and lower media consumption.
Exel appoints new electrical product business owner
To expand its market share and accelerate the uptake of insulating composites globally across the utility power infrastructure and machinery sectors, Exel Composites has appointed a new product business owner (PBO) for electrical, Heini Kloster. The move comes at a time when many countries like the USA are funding multi-billion-dollar electrical infrastructure updates to update ageing transmission lines.
Disea unveils two new small-size TFT Displays for medical and industrial applications
Display Technology are pleased to offer two new small-size TFT displays from Disea, that offer exceptional brightness, viewing angles, and temperature range.
Danfoss Power Solutions appoints new Director of Centre for Sustainability
Danfoss Power Solutions has named Carina Christine Skovmøller as Director of its Centre for Sustainability, a newly created role. Based in Copenhagen, Skovmøller reports directly to Andreas Schumacher, Senior Director, Centres of Excellence.
Infineon at electronica: decarbonisation and digitalisation
Infineon Technologies AG will be at the electronica trade fair to present its solutions for the major challenges of our time. Semiconductors make a wide variety of contributions to green and digital transformation and are the heart of every connected application.
The evolution of copper clip power MOSFET packaging
The rate of technology innovation is increasing, but one of the revolutions that inspired a shakeup of MOSFET packaging was the fast-evolving computing industry of the 1990s, when one of the areas that saw a seismic shift was in how to improve the performance available from the MOSFET packages.
STI Electronics hires Brian Tharp as Quality Manager
STI Electronics, a full-service organisation providing training services, training materials, analytical/failure analysis, prototyping and contract PCB assembly, has announced that Brian Tharp has been added to the STI Team as Quality Manager.
Adeia & Qorvo hybrid bonding license agreement
Adeia has announced that Qorvo has licensed Adeia’s hybrid bonding technology.
Infineon and FER: energy-saving microelectronics for decarbonisation
Infineon Austria and the Faculty of Electrical Engineering and Computing (FER) at the University of Zagreb have launched an academic cooperation in power electronics.
Flexible conductive adhesives for electronic wearables
When it comes to electronics, characteristics like bendability, flexibility, foldability and wearability become increasingly important.