Search results for "training "
element14 to auction ‘electronics waste sculpture’ at electronica to benefit charity
element14, Premier Farnell’s innovative online technology resource and community for electronic design engineers, and a leading authority on environmental legislation in the electronics industry, announces it will auction off its ‘electronics waste sculpture’ built over this week’s four day electronica event, 9-12 of November. The building of the sculpture can be watched via an exclusive web cam available through the element14 website at...
Digi-Key Corporation Inks Global Distribution Agreement with Everlight Electronics
Electronic components distributor Digi-Key Corporation, recognized by design engineers as having the industry’s broadest selection of electronic components available for immediate shipment, and Everlight Electronics Co. Ltd. have inked a global distribution agreement.
6000A and 6000B Series Surface Mount Power Inductors - PTM Preview
Visit http://bit.ly/6000AB to view the full product training module to learn more about Murata Power Solutions' 6000A and 6000B Series, designed to be used for energy storage, and input or output filtering of DC/DC converters.
Agilent Technologies Introduces Universal Testing Machine for Nanomechanical Characterization at 2009 Materials Research Society Meeting
Agilent Technologies Inc today introduced an easy-to-use, enhanced-performance universal testing machine that offers highly accurate nanomechanical characterization capabilities. The Agilent T150 UTM lets researchers investigate dynamic properties of compliant fibers via the largest dynamic range and best resolution on the market -- five orders of magnitude of storage and loss modulus.
congatec AG and xyco technologies AG agree intensive cooperation for fast and cost-effective integration of x86 computer modules in customer applications
congatec and xyco technologies have entered into a strategic partnership to accelerate and simplify the integration of x86 computer modules in professional customer applications. Under the terms of the cooperation, xyco will include congatec’s x86 computer modules (CoMs) as predefined ECAD building block macros in their Design-IP library to enable customers to realize their own carrier board designs quickly and cost effectively.
congatec Achieves Premier Member Status in Intel Channel Partner Program
congatec AG, a leading provider of embedded computer modules, announces that the company has qualified itself for Premier Member status in the Intel Channel Partner Program. The Intel Channel Partner Program awards different levels of membership status to Intel sales partners around the world depending on their size and focus.
Agilent Technologies Now Supports Real-Time Fading with PXB and Wireless Communications Test Set
Agilent introduced a real-time 2G/3G fading solution that features a direct digital connection between the N5106A PXB baseband generator and channel emulator and E5515C 8960 wireless communications test set. This is the most cost-effective cellular fading solution available for R&D engineers who need to validate the receiver sensitivity of wireless devices under real-world signal conditions.
Agilent - First Test Solution for PCI Express 3.0 Receiver Characterization
Agilent today announced the industry's first test set for PCI Express 3.0 receiver characterization. The Agilent PCIe® 3.0 receiver characterization test solution provides complete and accurate receiver tolerance test results while minimizing R&D effort. Using the Agilent test set, design and test engineers in the semiconductor and computer industry can accurately characterize and verify standard compliance of receiver ports in ASICs and chipset...
Adeneo Embedded launches Windows Embedded Compact 7 support for TI’s OMAP 4 platform
Adeneo Embedded, a Microsoft Windows Embedded Gold Partner, which received the “Windows Embedded Excellence Award” by Microsoft from 2007 through 2010, announced a full suite of support services—including customized support, training and development service—tailored to assist original equipment manufacturers (OEMs) seeking to develop Windows Embedded Compact 7 on the OMAP™ 4 platform from Texas Instruments Incorporated (TI).
Adeneo announces Windows Embedded CE 6.0 reference BSP for the LPC3250
Adeneo, a Microsoft Windows Embedded Gold Partner with facilities in Europe and in the USA, today announced the full commercial release of the Windows Embedded CE 6.0 reference BSP for the LPC3250 ARM9 processor-based microcontroller from NXP Semiconductors targeting consumer, entertainment, industrial, medical and automotive industries.