Search results for "Master Bond"

NXP Semiconductors today announced second quarter sales of USD 857 million, a comparable increase of 26.2% from the first quarter of 2009. The increase in sales is mainly attributable to supply chain replenishment following a soft first quarter of 2009 and the continued impact of various, mainly Chinese, stimulus packages.

NXP Semiconductors N.V. today introduced the industry’s first development platforms for DALI and DMX512 wired lighting control systems based on the low-cost, low-power 32-bit ARM Cortex-M0 processor. The new evaluation systems feature an NXP LPC1100XL series microcontroller, which is uniquely suited to handle the communication requirements for intelligent lighting projects using DALI and DMX.

Maxim introduced the MAX12005, the industry’s first 8 x 4 satellite IF switch IC that is expandable to allow up to 16 satellite signals. Highly integrated, the MAX12005 is flexible and adaptable for a wide range of space-constrained, satellite IF distribution and multiswitch applications.

The cold winter months have seen several conflicting reports about the UK's future electricity generation capacity come to light, with government and related agencies trying, somewhat in vain, to maintain confidence whilst delivering a realistic outlook for the coming years. But one thing recent statements have made clear, is that things are likely to get much worse before they get better, says Uninterruptible Power Supplies Ltd (UPSL).

Multi-Contact's adjustable XSAP-4 test probe has won a MessTec & Sensor Masters Award 2011. The probe, which was launched earlier this year, was voted third place in the test and measurement category.

Imagination Technologies, the leading multimedia chip technologies company is working with partners including Digital Legends, Fishlabs, Teleca, Digital Aria and TAT to bring the best in new mobile multimedia and communications demonstrations and devices to MWC 2010 in Barcelona from February 15 – 18th.

MH&W International has introduced Keratherm KL 90 highly thermally conductive, double-sided adhesive tape which provides 1.4 W/mK of thermal conductivity – said to be three times higher than other thermal tapes – for more effective heat transfer from hot components to heat sinks. The new tape’s thermal impedance is just 208°C-mm2/W (0.32°K-in2/W).

Custom Interconnect (CIL) will demonstrate examples of its world-class electronics design and manufacturing capability and show a number of new LED based products on Stand D25 at Southern Manufacturing & Electronics Exhibition to be held at FIVE, Farnborough, Hampshire on February 10th and 11th 2010.

CIL’s Electronics Manufacturing Facility has been based in Andover, Hampshire since 2005 and currently employs 120 personnel at its headquarters in Charlton Road, Andover. To meet the planned growth and the increases we has seen in full product manufacturing, CIL has invested in an additional 10,000 square feet of Product Manufacturing Facility in Andover.

Synopsys announced the immediate availability of the DesignWare MIPI 4G DigRF(SM) Master Controller IP. By complementing its current silicon-proven DesignWare MIPI 3G DigRF Controller and PHY IP, Synopsys becomes the first vendor to offer a comprehensive IP portfolio for both the MIPI DigRF v3 and v4 standards.