Search results for "advanced engineering"
Renesas and Intel collaborate on power management for Core Ultra 200V processors
Renesas Electronics, a premier supplier of advanced semiconductor solutions, has announced a collaboration with Intel resulting in a power management solution that delivers best-in-class battery efficiency for laptops based on the new Intel Core Ultra 200V series.
DELO introduces UV-approach for fan-out wafer-level packaging
DELO has developed a new approach for fan-out wafer-level packaging (FOWLP). Its feasibility study shows: with the use of UV-curable moulding materials instead of heat curing ones, warpage and die shift can be reduced significantly. Additionally, this leads to improvements in curing time and minimises the energy consumption.
Finalists announced in 2024 create the future design contest
Mouser Electronics congratulates the finalists for the 2024 Create the Future Design Contest, a global challenge to engineers and innovators around the world to design the next great thing.
NXP’s advanced Trimension UWB portfolio hits the road with Audi
NXP Semiconductors has announced that its Trimension NCJ29Dx family, part of one of the industry’s broadest UWB portfolios, is the technology foundation for Audi’s advanced new UWB platform, delivering the precise and secure real-time localisation required by leading premium car manufacturers to enable hands-free secure car access via smart mobile device and other UWB-based features.
Altus partners with G&B Electronic Designs
Altus Group, a distributor of electronics assembly equipment in the UK and Ireland, has supported G&B Electronic Designs, a prominent EMS in the UK, in enhancing its inspection processes through the installation of the Koh Young Zenith Alpha HS+. This advanced True 3D Automated Optical Inspection (AOI) system has strengthened G&B’s already strong commitment to maintaining high-quality standards in PCB assembly.
SEMICON Europa to explore advanced packaging and fab management
Semiconductor industry experts will convene at SEMICON Europa 2024,12–15 November 2024 at Messe München in Munich, to explore the latest trends and innovations in advanced packaging and fab management.
KYOCERA advanced ceramics for the semiconductor industry
KYOCERA has further developed its high-end ceramic Starceram N3000 P and has launched a new silicon nitride for the functional testing of next-generation microchips.
TRI at SMTA Space Coast Expo & Tech Forum 2024
Test Research, Inc. (TRI) will participate in the SMTA Space Coast Expo & Tech Forum 2024 on November 14, 2024, at the Melbourne Auditorium, Florida, USA.
Mercedes-Benz opens battery recycling plant
Mercedes-Benz has opened Europe's firstbattery recycling plantwith an integrated mechanical-hydrometallurgical process, making it the first car manufacturer to close the battery recycling loop with its own in-house facility.
Devon college hosts International conference on photonics and optoelectronics
A prestigious international conference and exhibition on photonics and optoelectronics packaging was held atSouth Devon Collegerecently.The event was in partnership with IMAPS-UK and the Torbay Hi-Tech Cluster, with visiting international delegates.