Search results for "TSMC"

Magma Design Automation Inc., a provider of chip design solutions, today announced TSMC has included the QCP™ extractor in TSMC’s quarterly EDA qualification report for 28-nanometer (nm) integrated circuits (ICs). This qualification gives designers additional confidence in using QCP to address the increasing complexity of ICs implemented in TSMC’s 28-nm processes.

Synopsys announced that it is delivering comprehensive design enablement for TSMC's 28-nm process technology, integrated manufacturing compliance and an advanced system-level prototyping solution, with TSMC Reference Flow 12.0. New features of the flow include virtual prototyping and high-level synthesis linked to TSMC's advanced processes, expanded manufacturing compliance capabilities and full support of TSMC's latest 28-nm design rules and mo...

Synopsys, Inc. (Nasdaq: SNPS), a world leader in software and IP for semiconductor design, verification and manufacturing, today announced that it has worked with TSMC to develop a broad portfolio of DesignWare® interface PHY IP including SuperSpeed USB 3.0, USB 2.0, HDMI, PCI Express®, DDR and SATA as well as embedded memories for TSMC's 28-nanometer (nm) process technology.

Synopsys, Inc. today announced immediate availability of DesignWare Embedded Memory and Logic Library IP for TSMC's 28-nanometer (nm) high-performance and high-performance for mobile process technologies. The Synopsys DesignWare Embedded Memories and Logic Libraries are designed to deliver high performance with low leakage and active power, giving engineers the ability to optimize their entire system-on-chip (SoC) design for speed and energy effi...

Xilinx announced the industry's first stacked silicon interconnect technology for delivering breakthrough capacity, bandwidth and power savings using multiple FPGA die in a single package for applications that require high-transistor and logic density, as well as tremendous levels of computational and bandwidth performance. By embracing 3D packaging technologies and through-silicon vias (TSV) for its 28nm 7 series FPGAs, Xilinx's Targeted Design ...

ARM and Cadence Design Systems, Inc. announced the tape out of the industry’s first 20nm design based on the ARM Cortex-A15 MPCore processor. The test chip, targeting TSMC’s 20nm process, was jointly developed by engineers from ARM, Cadence and TSMC using a Cadence RTL-to-signoff flow. Today’s milestone announcement is the result of an 18 month collaboration between ARM and Cadence on optimised design flows for the Cortex-A15 processor.

Magma Design Automation has announced that Vitesse Semiconductor Corporation, a leading provider of advanced IC solutions for Carrier and Enterprise networks, expanded deployment of Magma's Talus(R) 1.1 RTL-to-GDSII IC implementation software. A longtime Magma user, Vitesse utilizes the Talus platform to incorporate more functionality into ICs while reducing power consumption, turnaround time and development costs.

Magma Design Automation today announced that NetLogic Microsystems Inc. (Nasdaq: NETL), a worldwide leader in high-performance intelligent semiconductor solutions for Internet networks, has selected Talus for implementation of its next-generation knowledge-based processor and physical layer products. This expands upon the relationship between NetLogic Microsystems and Magma Design Automation, as NetLogic Microsystems has successfully taped out de...

At next week’s SPIE Advanced Lithography conference, imec announces the successful implementation of the world first 300mm fab-compatible Directed Self-Assembly (DSA) process line all-under-one-roof in imec’s 300mm cleanroom fab. The upgrade of an academic lab-scale DSA process flow to a fab-compatible flow was realized in collaboration with the University of Wisconsin, AZ Electronic Materials and Tokyo Electron Ltd. Imec’s DSA collaboratio...

SST Communications, a developer of RF front-end components and modules for a wide range of wireless applications and a subsidiary of SST (Silicon Storage Technology, Inc.) today announced that it has doubled the output power of its 2.4 GHz WLAN power amplifier (PA) offering with the new SST12CP11. Housed in a compact 3 x 3mm QFN package, the three-stage device achieves 34 dB power gain, 26 dBm and 25 dBm linear output power at 3.5% and 2.5% EVM, ...