Search results for "Panasonic"
Infrared Detectors Technology & Market Trends, a new report from Yole Développement
Yole Développement announces its Infrared Detectors Technology & Market Trends report. Yole Développement’s report provides a complete analysis, market segmentation and forecast by application, IR detectors technology analysis & evolution. It also focuses on the latest industry news and analysis of the new market entrants and exits. The report covers the IR sensors that supply a signal to be analyzed for detection rather than imaging.
Imec presents 4K2K CMOS image sensor together with Panasonic
Imec presents a CMOS image sensor capable of capturing 12-bit 4,000x2,000pixel progressive images at 60 frames per second. Based on a stagger-laced dual exposure, the image sensor developed with Panasonic, was processed using imec’s 130nm CMOS process on 200mm silicon wafers to deliver high-speed and high-quality imaging, at reduced output bit rate.
Vibration Energy Harvesters Enable SmartMesh IP Wireless Sensor Network
MicroGen reveal that vibration energy harvesting BOLT Power Cells (see Figure 1) enabled a live wireless sensor network using Linear Dust Networks LTC5800-IPM SmartMesh IP mote-on-chip at the Sensors Expo and Conference exhibition in Rosemont, IL on June 5-6, 2013. The Linear mote was powered by MicroGen’s piezoelectric Micro Electro Mechanical Systems vibrational energy harvester or micro-power generator technology.
OLED Lighting developments in Japan
According to analyst company IDTechEx, OLED and LED lighting are expected to compete directly in many instances in order to gain market share in the next decade. As discussed in the newly launched report, OLED vs LED Lighting 2013-2023: Forecasts, Technologies, Players LED lighting has come a long way and offers a better performance than OLEDs, and that at a lower cost. OLED lighting will therefore only gain market success if it clearly defines...
Imec showcases innovation in RRAM R&D at VLSI Technology Symposium
At this week’s VLSI 2013 Technology Symposium 2013, imec presented important findings increasing the understanding into the stochastic nature of Resistive Random Access Memory (RRAM) operation. Imec’s results are crucial steps forward to enable reliable implementation of the memory concept.
Imec presented the first strained Germanium devices at VLSI 2013 symposium
At the VLSI 2013 symposium, imec presented the first strained Germanium devices based on a Si-replacement process, where a Ge/SiGe quantum-well heterostructure is grown by epitaxially replacing a conventional Si-based shallow trench isolation. The technique allows for highly-versatile means of heterogeneous material integration with Si, ultimately leading the way to future heterogeneous FinFET/nanowire devices.
Trio Motion updates Motion Perfect v3 application development interface to include single-point HMI programming
Trio Motion Technology has updated its Motion Perfect v3 application development, configuration and connectivity software for the acclaimed MC4 Motion Coordinator range of multi-axis motion and machine controllers. The latest release, version V3.1.1, includes several new features and enhancements including single-point programming support for Trio’s new UNIPLAY HMI 7” and 10” operator interfaces, an updated Project Encryptor for code and in...
Dassault Systèmes Acquires SIMPOE
Dassault Systèmes today announced the acquisition of SIMPOE. The acquisition of SIMPOE, based in Torcy, France, expands Dassault Systèmes’ 3DEXPERIENCE platform and its SIMULIA, CATIA, and SolidWorks applications to create the most powerful portfolio of materials-intensive manufacturing simulation solutions on the market.
SiC Maintains Growth Despite 2012 Power Electronics Downturn
Yole Développement announces its SiC Market 2013: Technology and Market for SiC Wafers, Devices and Power Modules report. Yole Développement’s report focused on the entire value-chain, covers all SiC applications in low, medium and high power ranges and provides all metrics up to 2020. It also includes a Bill-of-Material analysis, to compare Silicon vs. SiC-based system costs, and a cost reduction roadmap for SiC devices.
IXYS Integrated Circuits Division Introduces New 350V Solid State Relay in a Miniature 8-Pin SOIC Package
IXYS Integrated Circuits Divisionis is pleased to announce the availability of the miniature 350V, 8-pin narrow SOIC, Dual 1-Form-A (2 Single-Pole, Normally Open switches in a single package) Solid State Relay. The CPC2030 is 40% smaller compared to the popular standard 8-lead SOIC, thus enabling significant board space savings.