Search results for "Master Bond"
Heat Curing Adhesive Features High Shear Strength and High Temperature Resistance
A one component epoxy resin system called EP11HT has been developed by Master Bond Inc for high temperature bonding applications up to 205°C . Master Bond Polymer System EP11HT is a heat curing, structural epoxy adhesive featuring high shear strength and easy handling.
PCB Protection with Master Bond’s Conformal Coating
As conformal coatings are becoming more essential to electronic assemblies, Master Bond broadens their protective conformal coatings line with the addition of UV10LV. A clear, highly non-conductive, UV curing conformal coating, it is designed to restrain the impact of moisture, dust, chemicals, and temperature extremes on electronic circuitry and components. I ts high resilience bonds will not deteriorate even when exposed to adverse environmenta...
One Part High Strength Epoxy With High Thermal Conductivity Meets NASA Low Outgassing Specifications
Resistance to impact, thermal shock, vibration and stress fatigue cracking is of vital importance in the aerospace, optical, medical and oil/chemical processing industries. Master Bond Polymer Adhesive Supreme 10AOHT-LO is a single component, no mix, thermally conductive compound featuring superior electrical insulation and toughness.
Two Part Epoxy Assures Dimensional Stability
Master Bond’s newly developed EP30LV-1 is a low viscosity, optically clear epoxy for general purpose bonding, coating, sealing and casting. Linear shrinkage after cure is 0.0003 inches/in. Its dimensional stability and low shrinkage make it an ideal optical epoxy.
PCB Conformal Coating Features Fast Tack Free Cure
Moisture-curing silicone conformal coatings are ideally suited as protective coatings for sensitive board components in demanding environments. However, electronic manufacturers avoided the use of silicone coatings in electronic packaging due to their long cure schedule that did not allow rapid assembly. Master Bond has developed a rapid tack free, ready-to-use silicone conformal coating called Master Sil 773, formulated to provide excellent pro...
Optically Clear, Highly Flexible Epoxy Cures at Room Temperature and Withstands Cryogenic Conditions
For demanding applications where highly flexible, impact resistant bonds are required, Master Bond developed Polymer System EP37-3FLF.
High Temperature Resistant, Toughened Structural Adhesive Cures at Room Temperature
Formulated for structural applications in extreme environments with temperatures from -80°F to +425°F, Master Bond Supreme 33 has superior resistance to thermal cycling, thermal shock and impact. This toughened, two-component epoxy offers high structural bond strength to a wide variety of substrates including metals, glass, ceramics, wood, vulcanized rubbers and many plastics. Supreme 33 also resists chemicals including water, oil and many orga...
Thermally Conductive Adhesives Keep Their Cool by Master Bond
Through heat dissipation, thermally conductive adhesives and potting compounds play a pivotal role in the protection of today's electronic circuitry. In tandem with the great growth of the technological sector comes the need for a new generation of innovative, highly advanced solutions capable of reliable performance in the ever increasing temperatures of electronic devices. Master Bond's white paper examines the challenges design engineers face...
NEC and Solomon Systech Test Interoperability of LCD Driver ICs and Bridge ICs for the MIPI DSI Specification
NEC Electronics and Solomon Systech Limited, a world leader in advanced display IC technology and a Contributor Member in the MIPI Alliance, today announced an agreement by the two companies to test the interoperability of liquid crystal display (LCD) driver ICs and bridge ICs for mobile phones based on the Mobile Industry Processor Interface (MIPI) Display Serial Interface (DSI) specification. Verification of the ICs will enable mobile phone ma...
NEC Electronics Europe Releases 78K0 Lighting Communications Demonstration Kit
NEC Electronics Europe today announced the release of the 78K0 Lighting Communications demonstration kit, enabling lighting ballast designers to adopt lighting specific communications such as DALI and DMX512. The kit includes a master communication controller board which provides interfaces and supports communications to lighting slave devices by DMX512, DALI and even IrDA for remote lighting controls including dimming.