Search results for "Master Bond"

The Genesys family of programmable power supplies from Lambda sets a new standard for flexible, reliable, AC-DC power systems in OEM, industrial and laboratory applications. Lambda’s new 5kW module offers one of the highest power densities available in a compact 2U unit, and complements the already highly successful 1U 750W half-rack, 1U 750W/1.5kW, 2U 3.3kW and 3U 10kW/15kW full-rack models.

Rapid Electronics has expanded its stock of Bergquist thermal management products to include high performance insulators, adhesives, gap filling and interface materials. With over 40 years experience, Bergquist are market-leading manufacturers of products that manage heat in electronic circuits, particularly around semiconductors. Whether at the design stage or at full production thermal interface materials are required for heat reduction and ins...

The new A8512 from Allegro MicroSystems Europe is a multi-output white LED RGB driver IC for the LED backlighting of large-area LCD monitors and television screens. The new device integrates a scalable-output boost controller operating in constant-frequency current mode control - adjustable between 300 kHz and 1 MHz - driving an external MOSFET. It integrates six internal current sinks each capable of sinking up to 80 mA, which can be combined to...

TESEQ has announced the introduction of its new NSG 3040 ESD test generator. The NSG 3040 is small, smart and has a high-contrast 7in touch-screen colour display and rotary control wheel to simplify programming with simple and intuitive operation. With its open modular architecture, the NSG 3040 is the ideal immunity test system for smaller engineering laboratories. The NSG 3040 offers outstanding capabilities to demanding EMC test companies and ...

Linear Technology has introduced a family of five single and dual high performance, wide bandwidth lowpass active filter / ADC driver amplifier products providing cost-effective solutions in the smallest form-factor for challenging filtering applications in broadband wireless communications and signal processing equipment.

Data Modul now offers value added LCD display solutions featuring performance enhancing glass bonding technology from Hitachi . By using an optical adhesive and a cost effective lamination process a glass substrate is bonded directly to the front of the TFT LCD module. The bonding process ensures that there is no air gap between the glass substrate and the display. The use of glass optical bonding technology coupled with an enhanced anti-refle...

Avalue’s SPC-Series is the ultimate industrial fanless rugged IP-65 solution. SPC-Series adopts Intel® Atom™ D525 Dual-core 1.8GHz CPU with ICH8-M Chipset which featuring superior performance, high reliability, low power consumption, durability and longevity.

GOEPEL electronics’ OptiCon AOI systems can now be utilised for automated inspection of bonding pads for solder splashes, deformations and any other impurities in the micrometer range.

Kontron introduced the standard air-cooled version of the high performance Kontron 3U CompactPCI processor board CP3002 based on the latest Intel Corei7 mobile processor technology and Intel Platform Controller Hub QM57. The fanless Kontron CP3002 with low power consumption, low heat dissipation and integrated graphics is targeted for standard application environments with forced airflow. The newest processor board extends Kontron's CP3002 line o...

The VMS1 is an IEEE P1386.1 compliant PMC module that allows one or two standard CompactFlash memory cards to be used to build a compact and robust mass storage solution for embedded systems. The VMS1 is the latest addition to Varisys’ family Commercial Off The Shelf (COTS) products; where VME, PCI and PMC form factors host processor, I/O and storage functionality.