Search results for "Master Bond"
Laser Welding Bonds Craftsmanship with Technology for Jewellers
The jewellery industry is renowned as being built upon detailed knowledge of precious metals and gems coupled with intricate manual skills and techniques which have been used for generations. With such a traditional reputation, the image of the jewellery workshop to those outside of the industry might be considered to be that of a place left behind in the technology race. In reality however, today’s jewellery workshop is a place where traditio...
Advanced Industrial Ethernet Equipments Purchase Using the Ethernet Direct Shopping Cart
Ethernet Direct Corporation has developed an innovative and hassle free method of offering Industrial Ethernet equipment’s purchase by means of the Ethernet Direct global shopping cart.
Latest Strain Gage Catalog Contains Wealth Of Information
HBM's new catalog Strain Gages and Accessories is now available in both English and German versions. The catalog features all of HBM’s extensive range of strain gages and their specifications on nearly 100 pages.
Seika Machinery’s Michelle Ogihara Co-Hosts Successful SMTA Women’s Leadership Connection
Seika Machinery, Inc., a leading provider of advanced machinery, materials and engineering services, announces that Michelle Ogihara, Sales & Marketing Manager, co-hosted the Women’s Leadership Connection on Monday, October 25, 2010 in the Ocean room of the Walt Disney World Swan and Dolphin Resort. The wine and cheese reception was the first event that Ogihara helped to host since being appointed to the Board of Directors of the Surfac...
Low Profile Molex ClipLok Interconnect Clip Firmly Secures Circuit-to-Board Connections - ClipLok interconnect solution supports demanding design constraints and enables feature-rich applications at a reduced overall cost
Molex Incorporated introduces the ClipLok™ interconnect clip, an electromechanical connection that easily attaches to secure a membrane switch or FPC tail firmly to a printed circuit board, eliminating the need for mating connectors at each point. A first-to-market product, the low-profile ClipLok interconnect clip provides immediate and reliable circuit-to-board connectivity in a range of consumer, medical, networking and telecommunication...
NCMT to show expanded product range
NCMT will exhibit grinders from Okamoto, Japan, having been appointed to represent the manufacturer with effect from the start of this year.
Christopher Associates/Beijing Tonsan Adhesive Co. Ltd. to Present Evaluation of Sealants used in Photovoltaic Module Manufacture at AIMS/Harsh Environments Symposium at SMTAI 2010
Christopher Associates/Beijing Tonsan Adhesive Co. Ltd. announces that Jasbir Bath will present a paper titled “An Evaluation of Sealants used in Photovoltaic (PV) Module Manufacture” at the upcoming AIMS/Harsh Environments Symposium at the SMTAI Technical Conference, scheduled to take place October 25-28, 2010 at the Walt Disney World Swan and Dolphin Resort in Orlando, FL. The presentation will be held during Session HE3, titled “Organic ...
Krayden Introduces Dow Corning’s 700 Silicone Sealant
Krayden, Inc introduces Dow Corning’s 700 Silicone Sealant. The one-part RTV silicone-based rubber is weather resistant and holds up to extreme temperatures.
PE Accelerometers Feature Through-Hole Mounting
Measurement Specialties has released to production two new PE accelerometers for shock and vibration measurement. Models 7500A and 7501A feature welded construction and wide bandwidth to >15kHz. These hermetic devices offer outputs from 5.6pC/g to 20pC/g with operating temperatures from -73°C to +260°C.
Free Keithley Web-Based Seminar Explores New Measurement Techniques and Capabilities for Testing Flash Memory
Keithley Instruments will broadcast a free, web-based seminar titled “New Methods for Testing FLASH Memory” on Thursday, May 20, 2010. This one-hour presentation will examine new developments, such as multi-level cell (MLC), that are aimed at achieving increased density. The seminar will also explore the continuous advancements that are being made in measurement techniques and capabilities from characterizing a single transistor for developm...