Search results for "ai safety summit"

In March, the printed electronics industry flocked to Munich once again for the LOPEC 2024 conference and exhibition.

In the consumer device world, the Matter protocol is exciting huge interest because it holds out the promise – finally – that all smart devices in the home can respond to commands from a single controller or app.

ABB is working alongside Green Hydrogen International (GHI) to establish a substantial green hydrogen facility in South Texas, US. Under the Memorandum of Understanding (MoU), ABB's automation, electrification, and digital technology will undergo assessment for potential use at GHI's Hydrogen City project.

The Future of Flight action plan, jointly developed by the government and industry, has been unveiled by the Department for Transport (DfT).

Researchers at the Department of Energy’s Oak Ridge National Laboratory (ORNL)have revealed findings on operational requirements of eVTOL (electric vertical takeoff and landing vehicles) batteries in efforts to expedite flying electric vehicles.

Leaders from the artificial intelligence (AI) industry gathered in Parliament for a special debate on the ethical and regulatory challenges posed by the technology to the UK.

TE Connectivity will showcase a broad range of high-speed data communications connectivity solutions in booth B26 at the OCP Global Summit Oct 17-19, 2023 at the San Jose Convention Centre.

The World Health Organization (WHO) reported that in 2022, an estimated 600 million people suffered illnesses due to contaminated food, highlighting the urgent need for advanced solutions in food safety.

British semiconductor researchers and enterprises are set to gain significantly increased access to research funding, thanks to the UK's recent entry into the EU’s ‘Chips Joint Undertaking’ as part of Horizon Europe.

Farnell has launched its new Design, Build, Maintain HUBto support how developers, OEMs and industrial customers navigate every stage of the product lifecycle, from conception to maintenance.