Search results for "Qualcomm"
Camera, gyro & accelerometer data offer comprehensive motion tracking & mapping
Qualcomm has announced at Google I/O that its Snapdragon 810 processor will power Google’s next-gen Project Tango smartphone development platform. Project Tango devices combine camera, gyroscope, and accelerometer data to estimate six degrees of freedom motion tracking, providing developers the ability to track 3D motion of a device while simultaneously creating a map of the environment.
Open-source board based on i.MX7 microprocessor
An open-source, specification-compliant board that is based on the new Freescale i.MX 7 microprocessor was announced at the Freescale Technology Forum by Arrow Electronics. Arrow also collaborated with Qualcomm Atheros, a subsidiary of Qualcomm on the board’s Bluetooth & Wi-Fi capabilities and with Linear Technologies on the board’s power supply.
Test conference steps on to international stage
The VOICE 2015 Developer Conference organised by Advantest became a truly international forum last month by holding the event in both Santa Clara, California and Shanghai, China – the first time that this annual gathering of test equipment users, suppliers and partners has been held outside the United States.
WiFi chips target the IoE
Qualcomm has announced that its subsidiary, Qualcomm Atheros, has introduced two new intelligent connectivity solutions for the IoE. The QCA401x and the QCA4531 bring feature-rich WiFi and broad ranging capabilities to connect products and are each accompanied by development platforms to give customers an expedited and cost-effective path to deployment.
Cloud software simplifies the development of IoE devices
Qualcomm has announced that its subsidiary, Qualcomm Atheros, is expanding its IoE platform with the addition of six new ecosystem providers whose distinct client software for cloud services are now integrated within the QCA4002 WiFi solution and its accompanying development platform. The addition of these providers further simplifies the development of devices that use WiFi to connect to the IoE by increasing cloud service flexibility and making...
IoE solutions are being significantly adopted
Qualcomm has announced that its subsidiaries, Qualcomm Technologies (QTI), Qualcomm Atheros, Qualcomm Life and Qualcomm Connected Experiences (QCE), are achieving significant adoption of their broad connectivity, computing and solutions for the IoE. Driven by the significant growth and diversity of interconnected devices, Qualcomm companies are delivering the solutions and collaborating with technology leaders to empower manufacturers to create t...
Smart media platform features Bluetooth to WiFi re-streaming
Qualcomm Connected Experiences, a subsidiary of Qualcomm, has announced major feature additions to the Qualcomm AllPlay smart media platform including Bluetooth to WiFi re-streaming, custom audio settings and optimised synchronisation. Additionally, Hitachi America today announced the launch of three WiFi speakers powered by AllPlay.
Early 2015's top 20 semiconductor suppliers analysed
IC Insights will release an update to the 2015McClean Reportin late May 2015. Thisupdateincludes a discussion of the history and evolution of IC industry cycles, an update of the capital spending forecast by company, and a look at the top 25 1Q15 semiconductor suppliers (the top 20 1Q15 semiconductor suppliers are covered in this bulletin).
NXP & Qualcomm accelerate the adoption of NFC in wearables
NXP Semiconductors has announced that Qualcomm Technologies, a subsidiary of Qualcomm, will integrate its NFC and embedded Secure Element (eSE) solutions across its Snapdragon 800, 600, 400 and 200 processor based platforms.
Bottom-up prefill process holds promise for 7nm node
During the IEEE IITC conference in Grenoble, nanoelectronics research centre imec and Lam Research jointly presented a bottom-up prefill technique for vias and contacts. The technique, based on ElectroLess Deposition (ELD) of cobalt, is a highly selective method resulting in void-free filling of via and contact holes. Potentially increasing the circuit performance, it is a promising path to scaling advanced interconnects and enabling future logic...