Search results for "IBM"

Altera Corporation a annoncé aujourd’hui la mise à disposition de son kit de conception logiciel SDK pour OpenCL et de cartes de production tierces parties à l’appui. La disponibilité du SDK pour OpenCL permet aux programmeurs de logiciels d’accéder aux capacités hautes performances des circuits logiques programmables. Faisant également l’actualité de ce jour, Altera a annoncé un programme carte partenaire privilégiée (Preferre...

Altera today announced the broad availability of its SDK for OpenCL and supported third-party production boards. Availability of the SDK for OpenCL enables software programmers to access the high-performance capabilities of programmable logic devices.

Fujitsu today announced the launch of sales in Japan of three new and five upgraded software packages, all designed to transform work styles by leveraging data from smart devices, such as smartphones and tablets. The software is also scheduled to be released outside Japan.

ALTIS Semiconductor announced today the finalization of a foundry agreement with IBM Microelectronics. Under the terms of this agreement, ALTIS will be the foundry partner for the IBM 180nm SOI technology. ALTIS will deliver high volume products starting Q2 2013 and will secure capacity increase for 2014 and beyond to address the IBM forecasted demand.

More than 100 developer and adopter members of the Hybrid Memory Cube Consortium today announced they've reached consensus for the global standard that will deliver a much-anticipated, disruptive memory computing solution.

ProPlus Design Solutions have today announced the launch of NanoSpice, the next-generation high-capacity, high-performance parallel SPICE simulator for giga-scale circuit simulation. In announcing NanoSpice, ProPlus unveiled an innovative licensing model with simplified and practical control for parallelization, making it a cost-effective and powerful choice for advanced circuit simulations that designers typically don’t have.

IBM and NXP Semiconductors N.V. today announced the first results of a smarter traffic pilot, conducted in the Dutch city of Eindhoven. The trial demonstrates how the connected car automatically shares braking, acceleration and location data that can be analyzed by the central traffic authority to identify and resolve road network issues.

Yole Développement announces its Flip Chip Market and Technology Trends report. Yole Développement’s analysis updates the business status of the Flip-Chip market including data for TIM, underfills, substrates and Flip-Chip bonders. Discover fully updated 2010 – 2018 market forecast, detailed technology roadmap and bottom up approach, plus a strong focus on micro bumping for 3DIC & 2.5D.

Emerson Network Power revealed today that it will combine the capabilities of its Trellis platform with IBM IT service management software to significantly optimize the management of data center resources. This integrated data center infrastructure management solution will deliver increased energy and operational efficiency and improved IT service delivery.

Crocus Technology announces today the appointment of Dr. Ken Mackay as vice-president of technology development. Mackay was previously director of memory cell engineering at Crocus, a post he held for two and a half years, where he was in charge of developing and integrating magnetic and thermal properties of semiconductor materials.