Search results for "Master Bond"

SMTA China announced the Best Paper/Presentation and Best Exhibit Awards at its annual awards presentation held in conjunction with SMTA China and Hong Kong Chapter Breakfast Reception, which took place August 31, 2011 at the Ritz-Carlton Hotel in Shenzhen.

Single-part meshes and grids for a wide range of applications are proven to be cost effective alternatives to their woven wire mesh counterparts. In the majority of cases they provide superior performance, tailored to the specific application and size and shape requirement. When used in charged applications such as RFI shielding, they offer enhanced conductivity by having no cross-over areas and facilitate far easier electrical termination, by ha...

Nordson DAGE announced its new Materials testing capability on the 4000Plus at the Productronica exhibition that was held in Munich, Germany from November 15-18, 2011. Designed to support the materials testing needs of the microelectronics market, from static testing to fatigue, the 4000Plus has the flexibility required to characterize the mechanical properties of individual bonds, devices and circuit boards. The user interface is preconfigured f...

Nordson DAGE, a division of Nordson Corporation (NASDAQ: NDSN), announced the opening of a Repair and Calibration facility within its existing ISO 9001:2008 registered manufacturing plant based in Suzhou, China.

Nordson Corporation has announced the following promotions within its global leadership team. John Byers has been promoted to Chief Information Officer with global responsibility for leveraging information technology to support Nordson's growth and performance goals. Byers has served in a wide variety of leadership capacities in several functions since joining Nordson in 1994. As President of Nordson ASYMTEK since 2006, Byers was responsible fo...

Nordson DAGE announces it will exhibit in Booth #5971 North at the upcoming SEMICON West conference and exhibition, scheduled to take place July 10-12, 2012 at the Moscone Center in San Francisco, California. Featured at the show will be the Nordson DAGE 4000Plus Bondtester – the new industry standard in bond testing with unsurpassed data accuracy and repeatability.

Nordson DAGE, a division of Nordson Corporation will highlight its 4000Plus multi-purpose bondtester in Booth F05 within the Singapore Pavillion at NEPCON Vietnam, scheduled to take place October 6-8, 2011 at the Saigon Exhibition and Convention Centre in Ho Chi Ming City.

Tektronix announced the TDS1000C-EDU Digital Oscilloscope Series designed for first-time oscilloscope users and students. Packed with features and built-in tools, the new model is easy to learn and operate and very affordable. It also includes an Education Resource CD to help students master the use of an oscilloscope.

WFX is about creating places for people to worship and build communities. At the show, Atlona will demonstrate the right A/V solutions for houses of worship to communicate their messages more quickly and with ease

IPC — Association Connecting Electronics Industries® announces the first annual IPC Midwest Hand Soldering Competition, September 21–22, 2011, at the Renaissance Schaumburg Hotel and Convention Center, Schaumburg, Ill. Held in conjunction with IPC Midwest Conference & Exhibition, the contest will pit competitors against each other to build a functional electronics assembly within a 30-minute time limit to ultimately determine who the best-of...