Search results for "torque sensors"
MEGATRON optimises its KT705 and KT805 bending beam electronics
MEGATRON's KT705 and KT805 force transducers have been fitted with completely new electronics to improve optimisation.
Powercast receives Smart Buildings Innovation Award
Powercast announced that its Wireless 25-Year Maintenance-FreeBuilding Automation Sensor and Controller Technology for HVAC and LightingSystems has received anIoT Evolution Smart Buildings Innovation Awardfrom IoT Evolution World.
Infineon introduces the XENSIV sensor shield for Arduino
Infineon has announced the XENSIV Sensor Shield for Arduino, a versatile tool designed for evaluating smart sensor systems in smart home and diverse consumer applications.
Graphene bioelectronic mesh: the future of heart monitoring
Engineers from the University of Massachusetts Amherst and the Massachusetts Institute of Technology have created a new tool for monitoring the heart: a bioelectronic mesh that can measure both the physical movements and electrical signals of heart cells as they grow.
expands Micronas motor controller family HVC 5x
TDK Corporation is expanding its Micronas embedded motor controller family, HVC 5x, with the introduction of HVC 5222D and HVC 5422D models to drive small brushed (BDC), brushless (BLDC), or stepper motors.
Fingerprints enhance Gothenburg HQ security with S-Key biometrics
Fingerprints has enhanced the physical access security at its Gothenburg headquarters by implementing S-Key biometric access cards from Freevolt Technologies, incorporating Fingerprints' T2 sensors.
FRAMOS Last Time Buy for Sony CCD sensors
FRAMOS is pleased to announce the Last Time Buy deadline for all Sony CCD sensors and according dates.
Hyundai Motor and Kia’s DAL-e Delivery robot arrives
Hyundai Moto) and Kia revealed the redesigned DAL-e Delivery robot, enhancing the original model introduced in December 2022.
Infineon MEMs microphones in stock at DigiKey
In stock at authorised distributor DigiKey are Infineon’s high-performance digital XENSIV MEMS microphones, which are qualified according to the automotive quality standard AEC-Q103-003.
Indium Corporation’s Sze Pei Lim at ICEP Japan
Indium Corporation’s Senior Global Product Manager for Semiconductor and Advanced Materials, Sze Pei Lim, is scheduled to present at the International Conference on Electronics Packaging (ICEP Japan 2024).