Search results for "miniaturisation"

More than 25 years ago, the Topled set a worldwide standard as the first surfacemountable LED. Osram Opto Semiconductors now presents the latest generation, the Topled E1608, which has a package that is smaller than its predecessor models by factor 20. Despite this considerable miniaturization the low-power LED is bright, reliable and robust. The compact Topled offers greater options and greater design flexibility, particularly for car interior a...

International Radio Frequency (RF) and microwave solutions provider, NuWaves Engineering, has released its smallest, lightest, and lowest cost bidirectional amplifier (BDA), the NuPower Xtender VU4GX01 (OEM) & VU4GX02 VHF/UHF RF BDA. The latest addition to NuWaves’ line of NuPower Xtender BDAs, these BDA modules feature high linearity performance, miniaturisation techniques for small size and low weight, high adjacent channel leakage ra...

The Flexible Electronics (FE) industry is currently in a growth phase. Keen research and development activities, coupled with advanced material development, are propelling the creation of diverse enabled technologies.

University of Michigan researchers have developed a concept for ferrofluid-based propulsion.As the trend for miniaturisation of electronic technology continues, more spacecraft and satellites are becoming smaller, with typical sizes reducing from about that of a fridge or small car to approaching a shoebox or even a smartphone.

A world-first nonDestructive quality control method from the National Physical Laboratory (NPL) has enabled Oxford Instruments to commercialise wafer-scale fabrication technology for 2Dmaterial MoS2.The demand for miniaturisation of electronics, such as smartphones, wearables and the IoT devices, is continuing to grow, but the industry is now reaching the scaling limit for traditional silicon materials.

In line with the trend to miniaturisation in the industrial sector, HARTING has introduced a new DIN 41612 multipoint connector that is only one third the size of previous versions.The new DIN 41612 3Q/3R type multipoint connector family is available with or without a PCB hold-down clip and is particularly designed for connecting two circuit boards located perpendicularly to or alongside each other.

It has been announced that the University of Twente’s RoboTeam, a multi-disciplinary student group that aspires to innovate in both robotics and Artificial Intelligence (AI), has received sponsorship from Nexperia, the former Standard Products division of NXP. The team competed in RoboCup 2017, the world championships of robot soccer in Japan which focuses mainly on AI.

Sensor fusion is an intriguing idea: if data from more than one sensor can be combined in the right way, the combined data can be more accurate, more reliable or simply provide a better understanding of the context in which the data was gathered. It is perfectly possible to combine data from two or more (or in fact, lots of) sensors to produce extremely rich, context aware data that eliminates the limitations in range oraccuracy of the individual...

Global provider of GaN power transistors, GaN Systems, has announced the closing of an investment round led by BMW’s investment arm, BMW i Ventures. Consistent with its investment strategy, BMW i Ventures recognises that GaN Systems’ products maximise the efficiency of electronic systems while dramatically reducing size, weight and overall system cost. The investment will be used to expand global sales and accelerate new product devel...

The world’s leading trade fair productronica, which takes place at the Messe München trade-fair center from November 14th–17th, 2017, will show what the future of electronics development and production will look like. As well as robotics and miniaturisation, the fair’s focal points will include semiconductor solutions and digitalisation. In addition, two other events— SEMICON Europa and IT2Industry—are being hel...