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Microchip introduces PCIe Gen 5 SSD controller family
The Artificial Intelligence (AI) boom and rapid expansion of Cloud-based services are acceleratingthe need for data centresto be more powerful, efficient, and highly reliable.
Mouser bolsters industrial automation linecard
Mouser Electronics has expanded its industrial automation line card and resource hub.
Exploring the BeagleBone Black: capabilities and uses
The BeagleBone Black, a low-cost, community-supported development platform, has garnered attention for its versatility and robust capabilities.
Taking a flight in 2030
Overcrowded airportsand increasing air traffic following the COVID-19 pandemic call for new innovative solutions in safety, efficiency, and sustainability, both on the ground and in the air.
Littelfuse introduces TVS diode series for avionics
Littelfuse has announced the release of the new SMBLCE-HR/HRA, SMCLCE-HR/HRA, and SMDLCE-HR/HRA High-Reliability Low Capacitance TVS Diode Series.
TE Connectivity GEMnet with TI’s FPD-Link IV
TE Connectivity (TE) has equipped its GEMnet connector system to work with Texas Instruments’ FPD-Link IV SerDes semiconductors to transmit high-resolution, uncompressed video and bidirectional control over lightweight cable assemblies and connectors in the automotive environment with near-zero latency.
Mouser adds trio of onsemi sensors
Authorised distributor Mouser Electronics has extended its range of sensors from onsemi.
MintNeuro launches EXPLORE with Innovate UK funding
MintNeuro has launched the‘EXPLORE’project, supported by a£100,000 grantfrom Innovate UK as part of theBiomedicalCatalyst Feasibility Competition 2023.
Meta’s Llama 3.1: what’s new?
Meta has recently introduced its newest range of AI models, Llama 3.1, so what’s new in this range and what might you expect to see?
Teledyne e2v HiRel new EP VHF to S-Band low noise amplifiers
Teledyne e2v HiRel has announced the availability of two enhanced plastic (EP) VHF to S-Band low noise amplifiers, models TDLNA2050EP and TDLNA0430EP which are ideal for use in demanding high-reliability applications where low noise figure, minimal power consumption and small package footprint are critical for success.