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Global electronics has more information to process than it knows how to handle. Data scientists are engineering next-generation strategies to parse it all.

PCIM Asia to return as PCIM Asia Shanghai in 2025, aiming to strengthen its role and reach in the Asian power electronics market.

Stackpole’s RNCU ultra-high power thin film chip resistors offer 1206 size rated at 1W.

The FunctionMAX family of connectors from Hirose are Board-to-Board connectors engineered for the demands of modern electronics systems.

The Chomerics Division of Parker Hannifin has introduced THERM-A-GAP PAD 80LO, a high-performance thermal gap pad with low oil-bleed and migration characteristics.

Richardson Electronics, Ltd. and Navitas Semiconductor announced an expanded distribution partnership for next-gen silicon carbide (SiC)power semiconductorsfor Europe, the Middle East, and Africa (EMEA).

Altus Grouphas announced its participation in the Southern Manufacturing & Electronics show, held from 4-6 February 2025 at the Farnborough International Exhibition Centre.

The Chomerics Division of Parker Hannifin Corporation has launched a rapid sampling and prototyping laboratory in the Czech Republic.

Raltron Electronicsannounces the release of its new RDM Series of MIMO antennas.

Electronic Specifier highlights the top 10 stories fromelectronica 2024, the world’s leading trade fair for electronics.