Search results for "photon chips"

Gregg Lowe is exiting his roles as Wolfspeed’s President and Chief Executive Officer and as a member of the Board. A search to identify a permanent CEO is underway.

RED Semiconductor has won a place to join the semiconductor industry’s highly acclaimed Silicon Catalyst Incubator programme.

MintNeuro, a pioneer of scalable, low-powersemiconductor technologyfor minimally invasive neural implant applications, has raised £1 million in a funding round led by Empirical Ventures.

Sondrel, a provider of ultra-complex custom chips, has announced the availability of its in-house IP for licensing. This starts with a suite of IP blocks for general SoC management to control start-up of devices, clock and reset control and power domain handling.

MIT researchers have developed a method to generate synthetic electromagnetic fields on superconducting quantum processors, advancing the capacity of quantum computers to emulate complex materials.

The Fraunhofer IPMS, Dresden and the Max Planck Institute for Microstructure Physics, Halle, are collaborating on innovative spin-based memory and logic components that operate at low temperatures.

In the dynamic world of optoelectronics, where light and electronics come together, connection technology plays a crucial role in the performance and lifespan of laser diodes (LD) and photodiodes (PD). Tresky is offering customised solutions that are specially tailored to the requirements of DIE bonding of laser- and photodiodes.

Paige West speaks with Rob Moffat, Deputy Director Sales & Business Development Europe at MediaTek about the role of semiconductors in the future of mobile gaming innovation.

Following his achievement of the 2024 Millennium Technology Prize, Electronic Specifier spoke with the inventor of the IGBT, Professor Bantval Jayant Baliga, on what it means to him and what he hopes to see in the future.

Electronics Manufacturing Services (EMS) provider, ESCATEC, has successfully integrated a UV light feature to its die bonder, significantly enhancing the precision and efficiency of the micro-assembly processes.