Search results for "geometry"

Mouser Electronics has agreed a global distribution deal with Quantic X-Microwave, producers of modular electronics for prototyping and developing RF and microwave products.

Several new AI solutions spanning industrial, HVAC and automotive applications will be showcased at Sensors Converge Tradeshow June 20-22 in Santa Clara, California.

Siemens Digital Industries Software has collaborated with leading Outsourced Assembly and Test (OSAT) company Siliconware Precision Industries (SPIL) to develop and implement a new integrated circuit (IC) package assembly planning and 3D layout vs. schematic (LVS) assembly verification workflow for SPIL’s fan-out family of advanced IC packaging technologies.

X-FAB Silicon Foundries SE says it has built on its position in BCD-on-SOI technology, by being the first foundry to introduce a 110 nm solution.

For over a year Zortrax has been a contractor of the European Space Agency (ESA)in a project aimed at developing new 4D printing technologies for space industry.

Die-casting enables the production of electronics housings in application-specific sizes and shapes and offers an economical manufacturing solution even for small-batch production, despite the tooling costs involved.

Bo announces the move to production and confirms full launch specifications of the Bo M, a new electric vehicle for city riders.

Amphenol RF has announced an expansion to their line of FAKRA interconnect with a universal FAKRA cap.

Multi-voltage electrical systems, intelligent network topology, more complex controllers: E-mobility and automated driving systems are changing the design of cable harnesses from the ground up, and they continue to evolve.

TDK has announced that subsidiary TDK Ventures is co-leading the latest round of financing in fusion-company Type One Energy.