Search results for "Rochester electronics"
ECS 2024 successfully concludes: industry insights and future outlook
On September 19, 2024, the Electronics Component Show (ECS) successfully concluded at Kassam Stadium in Oxford, UK, attracting numerous manufacturers, distributors, engineers, and procurement professionals in the electronic components industry.
Synopsys and TSMC Pave the path for trillion-transistor AI and multi-die chip design
Synopsysannounces its continued, close collaboration with TSMC to deliver advanced EDA and IP solutions on TSMC's most advanced process and 3DFabric technologies to accelerate innovation for AI and multi-die designs.
Samsung electro-mechanics unveils high-voltage MLCCs for growing EV market
Samsung Electro-Mechanics has introduced a new line of multi-layer ceramic capacitors (MLCCs) designed to meet the increasing demand for high-voltage components in the electric vehicle (EV) industry. These new 1812-inch X7R MLCCs offer capacitance values ranging from 2.2nF to 470nF, with a notable rated voltage of up to 2000Vdc, making them ideal for high-voltage EV applications.
Altus Group introduces BGA re-balling to meet sustainability demands
Altus Group, a distributor of capital equipment in the UK and Ireland, has introduced an advanced BGA re-balling solution to address the electronics industry's growing focus on sustainability and cost-efficiency.
Transense's SAWsense technology selected for £11 million UK EV R&D project
Transense Technologies plc, has been chosen as a key partner in a £11 million electric vehicle (EV) research and development initiative. The project, co-funded by the UK Government through the Advanced Propulsion Centre (APC), reflects the UK’s drive toward electrification and sustainable automotive advancements.
Lane Electronics to show their connector and accessory range at EDS 2024
Lane Electronicsis a franchised assembling distributor with 50 years’ experience of supplying high-quality connectors and accessories from their headquarters at Slinfold Lodge near Horsham in West Sussex.
Bendable non-silicon RISC-V microprocessor
Qamcom has announced the completion of a joint research project, and the publication of an article titled 'Bendable Non-Silicon RISC-V Microprocessor'.
QPT partners with INOPOL to drive R&D and innovation in Coimbra, Portugal
QPT, a GaN-based motor drives, has announced its collaboration with INOPOL, the entrepreneurship and innovation hub of the Polytechnic Institute of Coimbra (IPC). This strategic move enables QPT to strengthen its research and development efforts while integrating into the local innovation ecosystem in Coimbra, near its Portuguese R&D office.
Toshiba expands its SiC diode range
Toshiba Electronics Europe has expanded its silicon carbide (SiC) diode range with the introduction of ten new 1200V Schottky barrier diodes (SBDs) in the TRSxxx120Hx series.
Würth Elektronik at electronica 2024
Würth Elektronik has announced that it will be exhibiting at electronica – the leading international trade show – in Munich, November 12-15, 2024.