Search results for "Pickering interfaces"
Pickering’s high power reed relays at electronica China 2024
Pioneering manufacturer of high performance reed relays, Pickering Electronics will showcase its comprehensive range of reed relays for high-end instrumentation, ATE (automatic test equipment), and semiconductor test – including its latest high-power reed relays, Series 144 – on booth #E7-7838 at the electronica China 2024, part of Messe München’s electronica series of events (that also includes Munich and India), taking pl...
Pickering Interfaces announce new MEMS-based RF multiplexers
Pickering Interfaces have announced at IMS a new range of PXI/PXIe RF (radio frequency) multiplexer (MUX) modules featuring a new switching technology.
Pickering Interfaces to showcase MEMs-based RF multiplexers at IMS 2023
Pickering Interfaces will showcase its range of RF & microwave switching, launching several new products, including the first modules in a new MEMS-based RF PXI/PXIe multiplexer family, on booth #1415 at IMS (International Microwave Symposium) 2023, at San Diego Convention Centre in California, USA from 13th to 15th June 2023.
Advantech receives 2024 IoT Edge Computing Excellence Award
Advantech has announced that the MIC-732-AO, UNO-148 V2, MIC-770 V3 + MIC-75GF10, and IPC-730 have each received a 2024 IoT Edge Computing Excellence Award from IoT Evolution World.
TactoTek secures $60M in funding led by Virala Group
TactoTek, the global In-Mould Structural Electronics (IMSE) technology pioneer, has announced the completion of a $60 million funding round led by Nidoco AB, part of Virala Group. The financing attracted significant investments from a premier consortium of financial and strategic investors including Cornes Technologies, Elo Mutual Pension Insurance Company, European Investment Bank, Finnish Industry Investment Ltd, 3M Ventures, Ingman Group, VTT ...
Littelfuse expands NanoT IP67-rated tactile switch series
Littelfuse, Inc. announced the expansion of its NanoT tactile switch product line. The series, featuring miniature, surface-mounted, waterproof tactile switches, now includes new operational force options and top- and side-actuated models, further enhancing its application innext-generation smart wearables, wireless headsets, portable medical devices, and IoT systems.
Hybrid bonding for data highways
The high-precision AMICRA NANO die and flip-chip bonder has been specially developed for the production of co-packaged optics where optical andelectronic componentsare integrated in a common housing.
Microchip to accelerate real-time Edge AI with NVIDIA Holoscan
To enable developers building artificial intelligence (AI)-driven sensor processing systems, Microchip Technology has released its PolarFire FPGA Ethernet Sensor Bridge that works with the NVIDIA Holoscan sensor processing platform.
New NTN wireless comms module from SIMCom
SIMCom has developed a new NTN (non-terrestrial network) satellite communications module.
New RedCap wireless communications modules from SIMCom
SIMCom has launched a new RedCap (reduced capability) wireless communication module range for cost-conscious IoT applications where full 5G performance is not required.