Search results for "Photonic Microsystems"
Ipri-Brown Begins Term as ASME’s 143rd President
Susan Ipri-Brown has begun her term as the 143rdpresident of the American Society of Mechanical Engineers (ASME), the Society announced during its annual meeting 4thJune 2024.
Allegro expands portfolio with Power-Thru combo chip
Allegro MicroSystems,a global pioneer in power and sensing solutions for motion control and energy-efficient systems, announces the launch of the third product in its High Voltage Power-Thru portfolio.
Wave Photonics secures £4.5M for deployment of light-based chips
Wave Photonics, a deep tech startup based in Cambridge, secured £4.5M to advance on-chip photonics designs for quantum technologies, sensors, and data centre applications.
Researchers develop world's first chip-based 3D printer
Imagine a portable 3D printer that could fit in the palm of your hand, enabling the rapid creation of customised, low-cost objects on the go.
Synopsys accelerates trillion parameter HPC & AI supercomputing chip designs
Synopsys, Inc. announced the industry's first complete PCIe 7.0 IP solution, consisting of a controller, IDE security module, PHY, and verification IP.
Lab-grown diamond proposes to heat up the quantum tech market
Material innovations underpin many of the exciting applications offered by emerging quantum technologies.
Imec demonstrates new die-to-wafer hybrid bonding
At IEEE ECTC 2024, imec presented a Cu-to-Cu and SiCN-to-SiCN die-to-wafer bonding process resulting in a Cu bond pad pitch of only 2µm at <350nm die-to-wafer overlay error, achieving good electrical yield. Such fine-grained die-to-wafer interconnects pave the way to logic/memory-on-logic and memory-on-memory applications. On the longer term, die-to-wafer bonding will enable also die- and wafer-level optical interconnects – for whi...
Light technologies buck trend despite global economic turmoil
Newly published research shows the photonics industries in Europe, the US, and Asia outpaced global GDP from 2019 to the post-pandemic period of 2022, growing at a CAGR (Compound Annual Growth Rate) of 6.8% despite geopolitical risks significantly affecting international trade.
GHSP uses Allegro MicroSystems’ tech to shift EV future with eVibe system
Allegro MicroSystems, a global specialist in power and sensing solutions for motion control and energy efficient systems, is pleased to announce that GHSP, a global provider of mechanical and electromechanical systems and portfolio company of JSJ Corporation, is closely collaborating with and has adopted Allegro’s best-in-class gate driver and vehicle sensor technology for its new eVibe vibration enhancement system.
Developing hybrid quantum-classical computing
ORCA Computing and Poznań Supercomputing and Networking Centre (PSNC) have announced a collaboration with NVIDIA, to accelerate the development of hybrid quantum-classical approaches.