Search results for "PVA"
Complex adhesion problems solved with Plasma
Whether bonding metal to plastic, silicon to glass, polymers to other polymers of different durometers, biological content to polymeric microtiter plates or even bonding to PTFE, plasma can be used to promote adhesion.This according to Michael Barden of PVA TePla, a company that designs and manufactures plasma systems.
Collaboration brings success to 2K coating dispensing optimisation
Electrolube is selectively partnering with key dispensing equipment manufacturers (including PVA, Nordson Asymtek and others) to ensure that its 2K conformal coatings enable customers to obtain optimum results from its range of two-part coating systems. Electrolube’s systems are specifically designed to combine the protection and properties of a resin with the straightforward application of a conformal coating without the use of harmful sol...
Promoting adhesion of conformable coatings
Exposure to water, dust, oil, chemicals, movement and extreme temperature changes can damage circuitry. This problem is exacerbated for multi-component printed circuit boards (PCBs) found in outdoor devices that must withstand a wide range of weather conditions for decades with little or no degradation in performance.
Ceramics 3D printed from foams
Doctoral student Carla Minas, from the Complex Materials group led by ETH Professor André Studart, has succeeded in creating a highly porous and yet extremely robust ceramic material, which she “printed” using an additive manufacturing process. The trick here was to use an “ink” consisting of a stable ceramic emulsion that did not collapse during or after printing. Using this technique, it is possible to manufacture...
3D printer enables rapid prototyping
The first 3D printer from CEL is available at RS Components. The Robox offers professional-quality specifications and exceptional print speed with future-proofing adaptability. It is suitable for a wide range of users including electronics, mechanical, and product engineers involved in creating designs and needing rapid prototyping capabilities, or those in the education field as well as domestic users.
Filaments extend FDM/FFF 3D printer capabilities
RS Components has extended its RS range of high-quality material filaments for 3D printers. The professionally approved RS filament range has been fully tested and delivers comparable high quality to that offered by the leading brands, but without a premium price tag. Significantly the filament is not machine specific and can be used with the majority of 3D printers that use the FDM (Fused Deposition Modelling) or FFF (Fused Filament Fabrication)...
3D printer extends filaments range
An advanced model of its IdeaWerk Pro 3D printer has been launched by RS Components. The printer, which is priced at £590, is capable of handling multiple types of filaments, including Flexible, PLA, ABS, PA/NYLON, PC, HIPS and PVA. The RS IdeaWerk Pro has many features in common with the RS IdeaWerk FDM 3D printer, which is selling at a reduced price of £490.
Aqueous Technologies to present at cleaning & reliability workshop
Aqueous Technologies has announced that its CEO Michael Konrad will present at the Huntsville Cleaning & Reliability Workshop, scheduled to take place on the 10th of September, 2015 in Huntsville, AL. Mr. Konrad will present A Candid Conversation About Cleaning during the free technical workshop. The event will be presented in cooperation with Henkel, KYZEN and PVA.
PCB switches offer range of mounting options
Twomedium power switch series, featuring either momentary or locking actuation configurations, has been added toC&K Component'sPCB-mounted switch product line.The PVA Series short-stroke key switches are designed for through-hole PCB soldering, and are available in either DPST (double pole, single throw) or DPDT (double pole, double throw) configurations.
PVA Tepla And Imec Demonstrate 3D TSV Void Detection Using GHz Scanning Acoustic Microscopy
Imec and PVA Tepla present breakthrough results in the detection of TSV voids in 3D stacked IC technology. After having applied Scanning Acoustic Microscopy to temporary wafer (de)bonding inspection, they successfully used new advanced GHz SAM technology to detect TSV voids at wafer-level after TSV Copper plating. Together, they will continue to investigate the applicability of high-frequency scanning acoustic microscopy for non-destructive submi...