Search results for "LEO"
The Rehm Technology Days 2024 – where the future meets technology
Traditionally, theRehmTechnology Days offer a valuable opportunity for knowledge exchange, networking, and discussion.
Preserving the cityscape: automated bicycle storage
Japanese manufacturer Giken implements automated underground parking system withigusenergy chains
2024 Advanced Engineering keynote speakers announced
Advanced Engineering, the UK’s premier annual event for the engineering and manufacturing sectors, has announced this year’s keynote speakers.
The benefits of semiconductor manufacturing in Low Earth Orbit (LEO)
The concept of manufacturing semiconductors in Low Earth Orbit (LEO) harnesses the unique conditions ofspaceto enhance the production quality and efficiency of these critical components.
Ariane-6 vs Falcon 9: can Europe compete with SpaceX?
The European Space Agency's (ESA) Ariane-6 rocket finally made its debut on 9th July 2024, from Europe’s Spaceport in French Guiana. This launch was a significant milestone for Europe, marking the first flight of the Ariane-6, which aims to replace the Ariane-5 and restore Europe’s autonomous access to space. However, the launch has since been sullied by a new debate – the Ariane-6 vs Falcon 9 from SpaceX.
Non-Terrestrial Networks, the Next Big Thing in 5G
Since the invention of mobile phones, cellular networks have relied on terrestrial infrastructures. For the first time in history, 5G technology can potentially migrate parts of the mobile network infrastructure to space through non-terrestrial networks (NTNs).
Chip giving cars fast data anywhere on the planet
Ensilica has revealed its collaboration with VITES to provide a beamformer chip tailored for satellite user terminals. Central to VITES's new ViSAT-Ka-band terminal, this chip will facilitate the design.
Fingerprints and IN Groupe launch contactless biometric card
Fingerprintsand INGroupe,through its SPS brand, apioneer in contactless and dual interface cards, announce the launch of its Secure Component solution for contactless biometric payment cards, supporting global card manufacturers to scale up production of next-generation payment cards.
Nexperia invests $200m in Hamburg
Semiconductor manufacturer Nexperia has announced a USD 200 million (approximately 184 million Euros) investment to develop the next generation of wide bandgap (WBG) semiconductors, including silicon carbide (SiC) and gallium nitride (GaN), and to enhance production infrastructure at its Hamburg site.
Microchip's transistors meet military standards
Microchip Technology, anaerospace and defence market supplier, has announced that its range of JAN transistors now meets the Military-Standard Enhanced Low Dose Radiation Sensitivity (ELDRS) requirements, including MIL-STD-750, Test Method 1019, and specifications such as MIL-PRF-19500/255, /291, /355, /376, and /391.