Search results for "ICs"

Researchers at the Fraunhofer Institute for Photonic Microsystems IPMS have developed a Universal Display Data Converter (UDDC). This enables the transfer of image data to existing Fraunhofer microdisplays from various input interfaces.

Würth Elektronik ICS will be showcasing its latest innovations including high-current contacts, at electronica, held from 12-15 November 2024.

Data centres currently account for over 2% of global energy consumption. With the rise of AI, this figure is predicted to increase to as much as 7% by 2030, which would be equivalent to the current energy consumption of India.

ROHM Semiconductor Europe is looking forward toelectronica 2024– the trade fair and conference for electronic components, systems, applications, and solutions. The event will take place between 12-15thNovember in Munich.

Navitas Semiconductorhas announced that its high-power GaNSafe family is now available in a TOLT (Transistor Outline Leaded Top-side cooling) package.

Apacer is set to showcase its latest industrial storage solutions at electronica 2024, from 12-15 November in Munich, Germany.

Photonic chip industry accelerator PhotonDelta is launching a global engineering contest in collaboration with Wevolver, the global knowledge and community platform for engineers, to stimulate the creation of new applications for photonic chips that tackle global challenges.

Siemens Digital Industries Software has announced that GlobalFoundries (GF) has certified Siemens' Analog FastSPICE (AFS) platform for its 22FDX, 22FDX+, 12LP, and 12LP+ Process Design Kits (PDKs).

STMicroelectronics, a global semiconductor pioneer serving customers across the spectrum of electronics applications, and Qualcomm Technologies International, a subsidiary of Qualcomm Incorporated, announce a new strategic collaboration for the next generation of industrial and consumer IoT solutions augmented by edge AI.

Eggtronichas unveiled a newevaluation boardthat allows engineers to quickly develop and prototype ultra-efficient, low-component count wireless power transfer designs for low-power applications.