Search results for "gallium nitride"
Power amplifier meets 2.7 - 3.5GHz RF-based designs
The QPA3069 power amplifier from Qorvo is now being shipped by Mouser Electronics. Engineered for defence and aerospace applications, the 100W QPA3069 provides high power density and power-added efficiency for 2.7 - 3.5GHz radio frequency (RF) based designs.
Extending silicon photonics with hybrid light sources
Imec and CST Global have announced the successful integration of InP distributed feedback (DFB) lasers from CST Global’s InP100 platform into imec’s integrated silicon photonics platform (iSiPP). Interfaces for hybrid integration of InP DFB lasers and reflective semiconductor optical amplifiers (RSOA) will become available as part of imec’s silicon photonics prototyping services in the first half of 2021, following further optim...
Quarter brick DC/DC converter supports GaN power amplifiers
Artesyn Embedded Power has announced its newest DC/DC converter module focused at Gallium Nitride (GaN) radio frequency (RF) power amplifier (PA) applications, the 500W AGQ500 series. Housed in the industry standard quarter-brick format, the AGQ500 series offers greater than 95% typical efficiency and a wide input range of 36 to 75V.
Three-phase GaN inverter reference design for integrated drives
This reference design from Texas Instruments is a three-phase inverter with a continuous power rating of 1.25kW at 50°C ambient and 550W at 85°C ambient for driving 200V AC servo motors. It features 600V LMG3411R150 Gallium Nitride (GaN) power modules with an integrated FET and gate driver mounted on an 1.95mm Insulated Metal Substrate (IMS) board for efficient heat dissipation.
RF front end module aims at massive MIMO designs
The ADRF5545A RF front end module from Analog Devices is now being shipped by Mouser Electronics. The dual-channel, integrated radio frequency (RF) receiver front-end module is designed for time division duplexing (TDD) and massive multiple-input and multiple-output (mMIMO) applications that operate in the 2.4GHz – 4.2GHz frequency range.
GaN systems and SPARX advance GaN in electric vehicles
GaN Systems has announced that SPARX Group ‘Mirai Creation Fund II’ has made an investment in GaN Systems. Mirai fund provides capital to companies with the goal of accelerating innovation, Vehicle Electrification being one of the major targets, to generate a ‘new power’ that will shape the future and impact our world.
Transform your automotive thinking with Farnell and ON Semiconductor
For the modern designer, there’s no time to waste when it comes to delivering innovation in a variety of growth verticals quickly. However, it's also no small feat to launch new products when the fast-moving automotive, IoT and industrial markets are more competitive than ever.
Software plug-in hastens double pulse testing
Double pulse testing in less than a minute is now possible on the Tektronix AFG31000 arbitrary/function generator with the availability of a new software plugin. It saves significant time compared to alternative methods.
GaN textbook with power conversion applications focus
Efficient Power Conversion Corporation (EPC) announce the publication of the third edition of ‘GaN Transistors for Efficient Power Conversion’, a textbook written by power conversion industry experts and published by John Wiley and Sons. It is designed to provide power system design engineering students, as well as practising engineers, basic technical and application-focused information on how to design more efficient power conversio...
Chip bonding adhesive delivers die shear strength of 60N/mm2
A thermally conductive, electrically insulating adhesive from DELO is available at distributor Inseto. The MONOPOX TC2270 is ideal for bonding silicon die and other applications where rapid heat transfer is essential. Heat build-up is a common reason for integrated circuit failure and the efficient dissipation of heat in power semiconductors, as used in automotive applications is a consdierable challenge.