Search results for "fraunhofer"
“Mainstream GaN” Today and Tomorrow: Spotlight on NXP’s High-Performance GaN Solutions at International Microwave Symposium 2012
Recognized as a compelling alternative to silicon for many RF applications, GaN technology has generated significant industry interest due to its performance advantages, but has faced significant challenges related to cost – until now.
German Research Project V3DIM Lays the Foundations in 3D Design for the Extremely High Frequency Millimeter-Wave Range
The “V3DIM” research project lays the foundations for working out the design requirements to develop innovative, highly integrated 3D System-in-Package (SiP) solutions for systems in the extremely high frequency range of 40 to 100 GHz, the so-called millimeter-wave range.
User and technology congress for system simulation in Dresden ITI invites to 13th ITI Symposium in November
ITI, one of the leading software and engineering companies for system simulation, is pleased to announce the dates of the 13th ITI Symposium to be held at the International Congress Center in Dresden on November 24th and 25th, 2010. Customers, partners and prospects can expect top-class user speeches from industry and research, innovative solution concepts, hands-on courses and inspiring discussions. Experienced ITI engineers and software develop...
Researchers have now developed an optical sensor for the windshield that can tell the difference between fog and darkness.
Driver-assistance systems help prevent accidents. Quite simply, the more a car knows about its surroundings, the more intelligently it can respond to them. Researchers have now developed an optical sensor for the windshield that can even tell the difference between fog and darkness. The system will also be available for small cars.
RESCAR 2.0 Enhances the Robustness of Electronic Automotive Components; Major Step on the Path to Becoming a Leading Electromobility Supplier
Whether in the powertrain, in central control units or in body and convenience electronics – there is a constant increase in the proportion of electronic components used in the car. This trend is accompanied by growing complexity of the systems installed, meaning that designers are forever faced with new challenges in the fine tuning. Six partners from all levels of the development chain have now joined forces in a quest to come up with overarc...
Stacking is in demand in the future
The new research project MANOS not only allows stacking artists, it welcomes them. With innovative surface coatings based on nanoparticles and the latest adhesive procedures, embedding technologies are advancing into new dimensions. That's because you can use the novel circuit board-based modular fasten and release technology to stack sensor systems.
Listening to the radio even with an electric drive
To enable radio reception in electric vehicles, manufacturers must install filters and insulate cables, since electrical signals will otherwise interfere with music and speech transmissions. Now, using new calculation methods, researchers are paving the way for pure listening pleasure while also helping to lower the associated costs.
Antonov Wins Idtechex Technology Award For Electric Vehicles
The UK based automatic transmission specialist Antonov has received the IDTechEx Electric Vehicles Land Sea Air ‘Technology Award’ presented for the most significant EV technical development over the past two years. Unlike other awards these encompass all land, sea and air electric vehicles, concentrating on technical breakthroughs worldwide.
The Latest Manufacturing Methods For Photovoltaic Modules Will Be On Show At LASER World of PHOTONICS 2011
Optoelectronic systems are being used to an increasing extent in the manufacture of photovoltaic (PV) modules and are helping greatly to increase production efficiency. In particular, laser technology is proving its superiority in processes such as material removal, fusion, soldering, welding and drilling. Lasers have become indispensable tools, especially in the manufacture of thin-layer solar cells. Manufacturers are therefore profiting directl...
austriamicrosystems enters the 3rd dimension with the unique “3D HallinOne” Magnetic Encoder family
austriamicrosystems announces the AS540x product family of 3-dimensional Hall encoders. The new 3D Hall element provides absolute and highest resolution with angular or linear output data. This new flexibility enables new solutions with improved performance for industrial and automotive applications. The AS540x Hall sensor series was developed in cooperation with Fraunhofer Institute for Integrated Circuits IIS in Germany - license holder of the ...