Search results for "TSMC"
Cadence Physical Verification System Qualified for TSMC 28nm, 20nm Process
Cadence Design Systems, Inc. today announced that TSMC has qualified the Cadence Physical Verification System for 28-nanometer design signoff, and completed Phase I certification for TSMC’s 20-nanometer process. Designers can request a PVS 20-nanometer technology file directly from TSMC for early design exploration, and access TSMC-Online to download 28-nanometer technology files for signoff.
CSR and TSMC extend collaboration to 90-nm embedded Flash process technology and IP
CSR plc. and TSMC today announced they are collaborating on the adoption of TSMC’s leading edge 90-nm embedded flash process technology, IP and RF CMOS processes for CSR’s next-generation wireless products. The 90-nm embedded flash process technology and IP can deliver twice the speed of previous generation 0.18-micron process technology and IP. It is ideal for portable communications, smart card and high-speed micro-controller applications....
Silicon Frontline - Post-Layout Verification Products Stand Out for Semiconductor Power Device, Nanometer and A/MS Design
Silicon Frontline Technology announced today that since the May introduction of the company and its first products, F3D (Fast 3D) for fast 3D extraction and R3D (Resistive 3D) for 3D extraction and analysis of large resistive structures, the company has achieved success and validated its position as a player in the post-layout verification and 3D extraction markets.
OmniVision Launches 2nd Generation BSI Technology
OmniVision Technologies, announced the introduction of the world’s first 1.1-micron backside illumination (BSI) pixel. The new OmniBSI-2™ pixel architecture represents a major milestone in digital imaging technology, and enables new imaging solutions with superior image quality and low-light sensitivity. The architecture also extends OmniVision’s pixel roadmap to sub-micron levels, and serves as a key enabler in the continuous miniaturizati...
Magma’s Titan Supports IPL 1.0 Standard for Interoperable Process Design Kits
Magma Design Automation announced today that the Titan Mixed-Signal Platform has been validated to support the interoperability and accuracy requirements of the IPL 1.0 Interoperable Process Design Kit (iPDK) standard. The Interoperable PDK Libraries (IPL) Alliance standard eliminates the need to develop multiple proprietary PDKs and design databases, reducing development costs, shortening delivery schedules and providing designers earlier acces...
Magma's Talus IC Implementation System Supports TSMC 28-nm Process Technology through Reference Flow 12.0
Magma Design Automation announced that Magma's Talus, Hydra, Tekton, QCP and Quartz DRC integrated circuit (IC) implementation and verification solutions have been qualified to support the TSMC Reference Flow 12.0. Through TSMC's Open Innovation Platform (OIP), Magma's product suite provides users with advanced features to address the challenges of 28-nanometer (nm) design.
Magma's Titan and FineSim Validated for TSMC's Analog/Mixed-Signal Reference Flow 2.0 for 28-nm Processes
Magma Design Automation has validated the Titan Mixed-Signal Design Platform and FineSim SPICE and FineSim Pro circuit simulation products for inclusion in TSMC's Analog/Mixed-Signal (AMS) Reference Flow 2.0. The TSMC AMS Reference Flow 2.0 targets its most advanced 28-nanometer (nm) process technology and includes a comprehensive design kit and new advanced custom design methodologies. Magma's Titan Mixed-Signal Design Platform and FineSim circu...
Magma’s Titan and FineSim Validated for TSMC’s First Analog/Mixed-Signal Reference Flow for 28-nm Processes
Magma Design Automation announced TSMC has validated the Titan™ Mixed-Signal Design Platform and FineSim™ SPICE and FineSim Pro circuit simulation products for TSMC’s first Analog/Mixed-Signal (AMS) Reference Flow inclusion, targeting its most advanced 28-nanometer (nm) process technology. The TSMC AMS Reference Flow 1.0 aims to address advanced process effects to accelerate next-generation analog/mixed-signal IC designs. The combination o...
Avago Technologies Extends Alliance with TSMC to include the next two generations of its enhanced-performance image sensor products
Avago Technologies today (July 20) announced that it has extended its agreement with TSMC to include the next two generations of its enhanced-performance image sensor products. Avago's 1.3-megapixel and newly introduced 2-megapixel sensors are already manufactured by TSMC and exhibit superior image quality and excellent uniformity. Avago Technologies will continue to work with TSMC to produce industry-leading multi-megapixel imaging products for...
Next-Generation 90nm SuperFlash Technology will be from SST and TSMC
SST (SiliconStorage Technology and TSMC (Taiwan Semiconductor Manufacturing Company) today announced the two companies have signed a new technology development and licensing agreement that will offer the first licensable 90nm embedded flash technology. Under terms of the agreement, TSMC will license SST's next-generation 90nm SuperFlash technology as part of TSMC's embedded flash memory portfolio.