Search results for "Leader"
UK's JET Fusion Lab ends experiments after 40 years
The UK's JET Fusion Laboratory is set to end its operations and decommission after a successful 40-year stint of experimentation and research.
EPI Forum to open doors in Barcelona on October 9-11
The European Processor Initiative (EPI), a project with 27 partners from 10 European countries, with the goal of helping to achieve EU independence in HPC chip technologies and HPC infrastructure has announced the first EPI Forum to be held in Barcelona, Spain, October 9-10, 2024.
TiniFiber appoints Tom Artinian as CEO
TiniFiber, the exclusive manufacturer of the US patented and UL-listed TiniFiber Micro Armor Fiber optical cabling solutions, is pleased to announce the appointment of Tom Artinian as CEO, effective immediately.
RECOM announces the acquisition of LECO
RECOM’s portfolio of products and capabilities is now significantly enhanced with the acquisition of LECO.
PCIM Asia 2024 concludes its most expansive event to date
PCIM Asia2024, Asia’s leading international platform for communication and exchange in power electronics, intelligent motion, renewable energy and energy management, concluded on 30th August 2024 at the Shenzhen World Exhibition and Convention Centre in China.
CVE’s Max Nentwich elected IIW Commission IV Vice-Chair
Max Nentwich, Head Laser Development Engineer atCambridge Vacuum Engineering(CVE), has been elected Vice-Chair of the International Institute of Welding’s Commission IV: Power Beam Processes.
Space-Comm Expo Scotland prepares to launch
SEC Glasgow to welcome global leaders to explore new frontiers at the biggest space industry event ever held in Scotland, 11 – 12 September.
SEMICON India will explore smart manufacturing and more
SEMICON India 2024, set to take place from 11-13 September in Greater Noida, Delhi NCR, will bring together global leaders, semiconductor experts, academia, and government representatives.
2024 Millennium Technology Prize awarded for IGBT tech
The 2024 Millennium Technology Prize has been awarded to Professor Bantval Jayant Baliga of North Carolina State University for his groundbreaking innovation, the commercialisation of the Insulated Gate Bipolar Transistor (IGBT) which has significantly reduced global electrical energy consumption and fossil fuel use.
Siemens' software adopted to streamline SoC development
Siemens Digital Industries Software has announced that SiliconAuto has adopted its PAVE360 software to streamline the development of its advanced semiconductors for the automotive sector.