Search results for "GEn AI"
Universal DC/DC converter with 6…36V input and selectable output 12V / 19V / 24V
The BICKER DC300WS is a powerful and fanless DC/DC converter with a very high efficiency of up to 98%. It offers an ultra-wide input range of 6…36VDC and allows flexible choice between 12V, 19V and 24V output voltages. The DC300WS was developed for the stable power supply of the latest motherboards with 12th & 13th Gen Intel Core processors. These CPUs have a highly dynamic power consumption with sometimes extreme performance boosts wi...
Real-time imaging data analytics of multiple high-end cameras
At embedded world, N.A.T. (Network and Automation Technology Corporation) is showcasing NATvision, a real-time, FPGA-based vision platform designed for high-resolution, advanced cameras, leveraging the MicroTCA standard.
NVIDIA generative AI research turns text to 3D objects
NVIDIA's latest foray into generative artificial intelligencehas yielded LATTE3D, a text-to-3D AI model that heralds a new era in digital creation.
COM-HPC Mini specification is now complete
congatec, a provider of embedded and Edge computing technology, welcomes the publication of COM-HPC Carrier Design Guide Rev. 2.2, which provides developers with performance specifications and a source of inspiration for the layout of modular designs on the basis of the small 95 x 70mm COM-HPC Mini specification.
Ekkono’s Edge ML simplifies deployment of AI for automotive applications
Automotive component suppliers and OEMs alike are faced with the challenge that every car is unique.
Avnet Silica to feature AI demos at embedded world 2024
Avnet Silica will host a series of live demonstrations under the umbrella theme of “The engineers of evolution” at embedded world 2024 in Nuremberg (April 9 – 11).
WEROCK presents new Rocksmart RSC616 industrial panel PC
WEROCK Technologies GmbH is expanding its product line with the Rocksmart RSC616, a powerful industrial panel PC with a large 15.6” display.
AMD at embedded world
AMD will kick off the upcoming embedded world 2024 conference in Nuremberg, Germany, 9–11 April 2024, with the opening keynote address on unlocking the potential of AI at the Edge.
Revolutionising wireless comms with 3D processors
In an era where seamless connectivity and real-time data exchange are paramount, scientists at the University of Florida have introduced a method to shakeup wireless communication through the development of three-dimensional processors.
300mm fab equipment spending forecast to reach $137B in 2027
Global 300mm fab equipment spending for front-end facilities is forecast to reach a record $137 billion in 2027 after topping $100 billion for the first time by 2025 on the strength of the memory market recovery and strong demand for high-performance computing and automotive applications, SEMI highlighted in its quarterly300mm Fab Outlook Report to 2027 report.