Search results for "nordic semiconductor"
Siemens delivers new Solido IP validation suite
Siemens Digital Industries Software has introduced Solido IP Validation Suite software, a comprehensive, automated signoff solution for quality assurance across all design intellectual property (IP) types, including standard cells, memories, and IP blocks.
CNIPA validates EPC's GaN gate semiconductor technology patent
Efficient Power Conversion (EPC) has announced that the China National Intellectual Property Administration (CNIPA) has validated the claims of EPC patent titled “Compensated gate MOSFET and method for fabricating the same” (Chinese Patent No. ZL201080015425.X) for enhancement-mode GaN semiconductor devices.
Worldwide silicon wafer shipments dip 5% in Q1 2024
Worldwide silicon wafer shipments decreased 5.4% quarter-over-quarter to 2,834 million square inches in the first quarter of 2024, a 13.2% drop from the 3,265 million square inches recorded during the same quarter last year, the SEMI Silicon Manufacturers Group (SMG) reported in its quarterly analysis of the silicon wafer industry.
SiC power equipment manufacturing
Investments and expansions at device, epiwafer, and wafer levels are driving growth in the multi-billion dollar SiC power market. Device manufacturers are constructing facilities in various regions.
Skylo certifies Sony’s Altair ALT1250 chipset
Skylo Technologies has announced the certification of Sony Semiconductor Israel’s (Sony) ALT1250 chipset as part of the Skylo Certification Program.
Littelfuse unveils single cell super capacitor protection IC
Littelfuse has revealed the newest member of its eFuse Protection IC lineup, the LS0502SCD33S.
Vishay extends critical manufacturing MES to semiconductor business
Vishay has extended its rollout of Critical Manufacturing’s MES from its initial site in the USA in 2019 to now include Vishay’s semiconductor manufacturing facilities.
Neusoft Reach and Ambarella partner for autonomous driving solutions
Neusoft Reach Automotive Technology (Shanghai) a subsidiary of Neusoft specialising in intelligent vehicle technology, and Ambarella, an Edge AI semiconductor company, announced the establishment of a strategic partnership at the Beijing Auto Show.
Indium expert to discuss Pb-free solder for power applications
Indium Corporation Product Manager – Semiconductor, Dean Payne will present at the Advanced Packaging for Power Electronics conference, hosted by IMAPS, held 8–9 May 2024 in Woburn, Massachusetts, USA.
GOWN wins award for FGPA design environment
GOWIN Semiconductor Corporation, an FPGA manufacturer experiencing rapid growth, announced the certification of its GOWIN EDA FPGA design environment