Search results for "microelectronics"
PAC Global at Upcoming SMTA Expos
Akrometrix has announced that its representative PAC Global will exhibit at the SMTA Houston & Dallas Expo & Tech Forums in Texas. The PAC Global team will discuss Akrometric’s TherMoire’ AXP modular metrology platform that provides shadow moire’, digital fringe projection and digital image correlation capabilities in one platform.
An internet of manufacturing standard for PCB assembly
Mentor Graphics Corporation has announced the launch of the Open Manufacturing Language (OML) initiative that directly addresses the longstanding need and urgent calls from the industry for a PCB assembly-specific Internet of Manufacturing solution.
Manufacturing solutions at SMT/Hybrid/Packaging
Rehm Thermal Systems looks forward to meeting you at this year’s SMT/Hybrid/Packaging in Nuremberg from April 26th to 28th, Europe's leading trade fair for system integration in microelectronics. The electronics industry continuously meets new challenges in the processing of sensitive electronic components – from processing the smallest components, the highest standards in void-free solder joints and increased quality through resistan...
Smart Systems Integration 2016 conference programme
The anniversary event of Smart Systems Integration offers in its conference a wide range of topics and casts an intensive glance at current trends and future developments in the industry. Latest digital solutions regarding the interconnection of sensors, equipment or products and their data analysis play an important role.
Edge metal squeegees added to product line-up
Microtronic has added Transition Automation’s Permalex Edge Metal Squeegees to its product lineup. Permalex Squeegees are a premium brand of metal squeegees used for SMT and microelectronics printing applications.
What’s new at IDTechEx 2016?
Green technologies will take centre stage at this year’s IDTechEx Show, taking place in Berlin from 27th-28th April. Among these will be electric vehicles, which will have a major emphasis at the session ‘Electric Vehicles: Everything is Changing’. Speakers and exhibitors from companies including Toyota, Daimler, Tesla, Siemens and IBM will showcase how mechanical, electric and electronic parts are completely changing and often ...
28nm IP leadership extended with latest UMC 28HPC POPs
ARM has announced the immediate availability of the ARM Artisan physical IP platform and ARM POP IP for United Microelectronics Corporation’s UMC 28HPCU, an enhanced 28nm process technology. This extends ARM’s 28nm IP leadership, giving the ARM ecosystem the broadest availability for 28nm foundation IP across all of the major foundries.
MWC 2016: Fingerprint authentication delivered for wearables
The first end-to-end security architecture for biometric fingerprint authentication has been presented at Mobile World Congress 2016 in Barcelona. It offers OEMs the opportunity to easily deploy this consumer-friendly feature in the latest generation of wearable and consumer electronics devices.
Germany’s Minister of Transport learns about the future of cars
The German Federal Minister of Transport and Digital Infrastructure Alexander Dobrindt acknowledges the importance of microelectronics as a key technology for the mobility of the future. Visiting the headquarters of Infineon Technologies, he learned about how the company is supporting policy goals to develop mobility: Infineon, with more than 40 years’ experience in automotive electronics, provides the technological prerequisites for the ma...
Design cycle assets centre stage at Embedded World
Supporting the entire design cycle is key to Mouser Electronics strategy. This includes a wide range of services, tools and products from leading suppliers making the development process easier, faster and more cost-effective, thus shortening time to market. All of these assets will be displayed on Mouser’s stand at the Embedded World exhibition in Nuremberg (Feb 23-25).