Search results for "Qualcomm"

The newly announced AirFuel Alliance has elected ON Semiconductor to the board of directors. The new consortium is focused on establishing a single, core, wireless charging standard to support a wide range of consumer, industrial, medical and military applications. Robert Klosterboer, Executive Vice President and General Manager of the ON Semiconductor’s Application Products Group, will represent the company on the board.

Qualcomm Technologies has announced that it has reached a milestone for its Qualcomm Snapdragon 410 and 210 processors. Within the first year of its commercial launch, the Snapdragon 410 processor, which brought 64-bit computing power and LTE connectivity to emerging regions, is now available in more than 550 mobile device designs.

Imec and Ghent University present, for the first time, arrays of indium phosphide lasers monolithically integrated on 300mm silicon substrates in a CMOS pilot line. This breakthrough achievement, published in Nature Photonics, provides a path toward high-volume manufacturing of cost-effective PICs with monolithically integrated laser sources. Such laser-powered PICs will revolutionise data transfer between future logic and memory chips.

16 exciting tech start-ups will be doing their best to impress a panel of over 30 judges including angel investors, VCs and tech giants, with their pitches at the 6th Discovering Start-Ups Competition final on 21st October. Anticipation is building not just on the side of the start-ups however as the judges look forward to what awaits in just under a week.

“The fact that TSMC is interested in advanced packaging isn’t 'new news'," comments Jean-Christophe Eloy, President & CEO, Yole Développement. “Over the last few years TSMC has significantly invested in flip-chip copper pillar capacities (Source: 2015 Flip Chip Business Update report, October 2015) and 3DIC stacking for CMOS image sensors and logic devices.”

ON Semiconductor has introduced a reference design implementing the new Qualcomm Quick Charge 3.0 protocol. The new protocol provides significant efficiency improvements over the existing Quick Charge 2.0 solution. The high efficiency, small form factor reference design supports the Quick Charge 3.0 high voltage dedicated charging Port Class A and Class B specifications, Qualcomm’s next generation of fast charging technology for smartphones...

Arrow Electronics – in collaboration with Qualcomm Technologies and Amazon – will showcase the new DragonBoard 410c “Internet of Things” (IoT) Starter Kit, which is based on the Qualcomm Snapdragon 410 processor and bundled with Amazon’s new IoT Software Development Kit (SDK), today at AWS re:Invent, the Amazon Web Services (AWS) annual user conference.

Qualcomm Technologies has introduced its next-generation of fast charging technology with Qualcomm Quick Charge 3.0 technology.

Qualcomm Technologies has integrated its newly upgraded X12 LTE modem into its upcoming Qualcomm Snapdragon 820 processor, providing leading 4G LTE and WiFi technologies for premium tier mobile devices. The processor addresses unprecedented demand for fast connectivity and seamless services.

Offering advances in both multimedia and connectivity for mid-range mobile devices, the Snapdragon 430 and the Snapdragon 617 have been introduced by Qualcomm Technologies.