Search results for "Master Bond"
Competing in-mould electronics manufacturing methodologies
Smooth, functional surfaces that provide touch sensing, often with backlighting, are becoming increasingly common.
Test solutions target EV battery packs
At Battery Show Europe in Stuttgart (May 23-25) Seica will present the latest test solutions developed specifically for the EV sector.
Critical Manufacturing to demo the latest MES at APEX 2023
Critical Manufacturing, a company that is redefining the role of manufacturing execution systems (MES), will exhibit with ASMPT, at the 2023 IPC APEX EXPO, Booth 1701, scheduled to take place Jan. 24-26, 2023, at the San Diego Convention Center in California.
Toughened One Part Epoxy Withstands Thermal Cycling
It has a moderately high glass transition temperature (Tg) of 150-155°C and a wide service temperature range from -150°F to +550°F. Designed to compensate for thermal mismatches, this compound resists impact, vibration, shock and rigorous thermal cycling.
Tresky's process development for reliable sintering with silver pastes
Recently, the German DIE bonding specialist Tresky introduced the reliable pre-sintering process with copper pastes.
Touch solutions for transport systems and in-vehicle applications
Review Display Systems (RDS) has announced the availability and support for a wide range of PCap touch solutions for in-vehicle and transportation from AMT.
Anritsu Field Master Pro wins Fierce Innovation Award
Anritsu announces that its Field Master Pro MS2090A real-time spectrum analyser has been named the winner in the Network Test & Measurement category Fierce Innovation Award – Telecom Edition 2022.
Greene Tweed appoints Magen Buterbaugh President and CEO
Greene Tweed announces the appointment of Magen Buterbaugh as President and CEO of Greene Tweed effective January 3, 2023.
Indium Corporation hires new Senior Manager for Corporate Quality
Indium Corporation is pleased to announce that Robert Atwood has joined the company as Senior Manager Corporate Quality.
Despite 2023 slump, wafer fab equipment revenue will recover
According to Yole Intelligence, part of Yole Group, after three years of consecutive record semiconductor wafer fab equipment revenues, we enter a period of equipment capacity digestion.