Search results for "tactical communications"

Researchers atChalmers Universityof Technology, in Sweden, have for the first time succeeded in combining two major research fields in photonics by creating a nanoobject with unique optical qualities.

Belden will showcase its Industrial Automation Solutions portfolio at the 32nd edition of SPS, the trade fair for smart and digital automation, held in Nuremberg on 14 to 16 November 2023.

JST Manufacturing has formally introduced itsOsprayfamily of single-wafer wet processing systems at Semicon Europa 2023 in Munich (November 14-17).

The West ofScotland SpaceCluster, the newest addition to the UK’s thriving ecosystem of regional space clusters, launches ahead of Space-Comm Expo Scotland at SEC Glasgow 11–12 September, one of the year’s biggest UKspace industryevents.

ProTek Devices has launched a new transient voltage suppressor (TVS) hybrid array, the PTA03-3.3ULC, designed to offer robust circuit protection in high-speed data line applications. This includes Ethernet, set-top boxes, xDSL, T1/E1 line cards, and ISDN.

As Apple prepares to introduce Apple Intelligence, a new survey by Amdocs, conducted by Dynata, has shed light on how consumer attitudes towards AI in smartphones differ across age groups.

Rohde & Schwarz will present its portfolio of high-performing solutions for the development, production and quality assurance of satellite communications and payload testing application at the UK Space Conference 2023 in Belfast (November 21-23).

With the project leadership of Keysight Technologies, the 6G-SANDBOX project signed a memorandum of understanding (MoU) with the Industrial Technology Research Institute (ITRI) to foster collaboration between Europe and Taiwanese companies for 6G research.

RanLOS, TOYO, AeroGT Labs, and Anritsu have revealed the first 5G antenna over-the-air (OTA) measurement system engineered with RanLOS’ OTA test solution and Anritsu’s 5G Radio Communication Test Station MT8000A.

A newly developed block copolymer is set to push the boundaries of integration andminiaturisation in semiconductor manufacturing, according to scientists from Tokyo Institute of Technology (Tokyo Tech) and Tokyo Ohka Kogyo (TOK).