Search results for "United Electronic Industries "

Digi International will reveal its newest addition to the Digi ConnectCore system-on-module (SOM) family at embedded world 2024 in Nuremberg (April 9-11).

Diamfab, a semiconductor diamond deeptech, has announced a first round of funding of €8.7 million, from Asterion Ventures, the French Tech Seed fund managed on behalf of the French government by Bpifrance as part of France 2030, Kreaxi with the Avenir Industrie Auvergne-Rhône-Alpes regional fund, Better Angle, Hello Tomorrow, and Grenoble Alpes Métropole.

Arrow Electronics, in collaboration with Infineon Technologies AG, has unveiled a 240W USB Power Delivery (PD) 3.1 reference design board, designed to facilitate high-power applications for customers.

Advanced Energy Industries, a global pioneer in highly engineered, precision power conversion, measurement, and control solutions, has launched Evergreen, the next-generation modular high-power platform, with two new air-cooled Vento products.

Innoscience welcomes two decisions, from March 20, 2024, by the United States Patent and Trademark Office (USPTO) to institute review of the validity of the two remaining US patents, as asserted by Efficient Power Conversion Corporation (EPC) against Innoscience.

Concluding Europe's largest ever research initiative to date, the Graphene Flagship officially wrapped up at the end of last year and has left an indelible mark on material science and research innovation.

Test Research, Inc. (TRI) announces the launch of the SEMI 3D CT AXI solution, TR7600F3D SII Plus, marking a paradigm shift in precision and reliability for high-reliability electronics manufacturing, such as the Advanced Packaging Industry.

The first plasma-FIB scanning electron microscope in Finland has just become operational at VTT in Espoo, Finland.

Electronic Specifier’s Paige West recently visited NXP Semiconductor in Munich for the launch of its new S32 CoreRide platform for software-defined vehicles (SDV).

Researchers have designed a scalable, fully-coupled annealing processor with 4,096 spins, with parallelised capabilities for accelerated problem-solving.