Search results for "semiconductors"
LPCXpresso Development Platform from NXP Video
LPCXpresso is a new, low-cost development platform available from NXP. The platform supports ARM-based LPC microcontrollers and includes a simplified Eclipse-based IDE and a low-cost target board combined with a JTAG debug probe called LPC-Link. Designed for simplicity and ease of use, the LPCXpresso IDE will provide software engineers a quick and easy way to develop their applications.
NFC demo on Nexus S Phone
NXP has formed a strategic collaboration with Google to provide a complete open source software stack for Near Field Communication (NFC). The NFC stack will be fully integrated and validated on Gingerbread, the latest version of the Android™ platform. This video demonstrates the use of NFC on the on the Nexus-S.
NXP Announces GreenChip Solution for Non-Dimmable LED Retrofit Lamps
NXP Semiconductors N.V. today announced the SSL21081, a highly efficient, high-voltage LED driver IC for compact, non-dimmable retrofit lamps based on GreenChip technology. The SSL21081 platform makes it easy for LED retrofit lamp manufacturers to design cost-effective applications for the 100V, 110V and 120V markets with up to 95 percent efficiency, underscoring NXP’s commitment to smarter energy-efficient lighting solutions.
NXP’s New Dual-Core Cortex-M4 and M0 MCU Redefines Digital Signal Control
NXP Semiconductors announced the LPC4000 family, the world’s first asymmetrical dual-core digital signal controller architecture featuring ARM® Cortex™-M4 and Cortex-M0 processors. The LPC4000 brings the advantage of developing DSP and MCU applications within a single architecture and development environment. With this dual-core architecture and a set of unique configurable peripherals, the LPC4000 enables customers to develop a wide range o...
NXP Announces Industry’s First Integrated CAN Transceiver Microcontroller Solution
NXP Semiconductors (Nasdaq: NXPI) today announced the LPC11C22 and LPC11C24 – the industry’s first integrated high-speed CAN Physical Layer transceiver and microcontroller with easy-to-use on-chip CANopen drivers. Offered as a unique System-in-Package solution, the LPC11C22 and LPC11C24 with integrated TJF1051 CAN transceiver combine complete CAN functionality into a low-cost LQFP48 package.
NXP Enables the “Internet of Things” with JenNet-IP Software
NXP announced its intent to make its JenNet-IP ultra-low-power, IEEE 802.15.4-based wireless connectivity network layer software available under an Open Source license, as part of its vision to enable the “Internet of Things.”
NXP's TFA9887 IC Blows your Mind, Not your Speakers
The TFA9887 IC from NXP has an amazing embedded algorithm which increases the output power of micro speakers by over 5 times, vastly improving the sound quality of mobile devices. By driving over 2.6 watts RMS into micro speakers that have previously been limited to 0.5 W, the NXP TFA9887 IC will give mobile phones, portable music players and tablets much louder sound, deeper bass, and higher sound quality – without risking speaker damage.
ARM, IBM, Samsung, GLOBALFOUNDRIES and Synopsys Announce Delivery of 32/28nm HKMG Vertically Optimized Design Platform
ARM, Samsung Electronics, Co., Ltd., GLOBALFOUNDRIES and Synopsys today announced the delivery of the industry’s first complete vertically optimized 32/28 nanometer (nm) design platform. Demonstrating the strength of the collaboration established and announced at DAC a year ago, the companies are collectively providing a technology enablement solution for the design and manufacturing of advanced mobile and embedded devices.
Synopsys Adds TDD Support to LTE Model Library
Synopsys, Inc. today announced the availability of the Time Division Duplex (TDD) mode in its Long-term Evolution (LTE) Model Library for physical layer system simulation. The addition of the TDD mode to the proven LTE Model Library enables developers of semiconductors for LTE network equipment and devices to quickly and reliably extend their designs to support this important version of the 3rd Generation Partnership Project (3GPP) LTE standard.
Synopsys and Varian Collaborate on Process Models for Advanced Logic and Memory Technologies
Synopsys and Varian Semiconductor Equipment Associates, Inc. (Nasdaq: VSEA), the leading producer of ion implantation equipment used in the manufacture of semiconductors, today announced a collaboration to develop Technology CAD (TCAD) models for cryogenic ion implantation. By enabling faster optimization of the cryogenic implant process through simulation, the models derived from this collaboration will speed up process development of advanced C...