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Toradex has launched its early access programme in partnership with NXP Semiconductors, featuring the Titan Evaluation Kit that leverages NXP’s i.MX 95 Applications Processors.

Quinas has announced that it has been awarded an Innovate UK project worth £1.1 million to be carried out jointly with IQE and the Universities of Lancaster and Cardiff, accelerating ULTRARAM industralisation.

Europlacer is set to unveil its advanced stencil printer platform at Productronica 2023, developed within its acclaimed UK stencil printing research facilities.

In a significant industry move, the world’s most valuable chip manufacturer, Nvidia, and iPhone assembler, Foxconn, are pioneering the construction of what are being termed as "AI factories."

Pixus Technologies has unveiled a new 1U tall, rackmountable enclosure capable of housing two X310 Software Defined Radios (SDRs) from NI’s Ettus Research brand.

Pasternack has unveiled its sophisticated array of rubberduck and whip-style antennas. These antennas are designed to improve wireless applications, showcasing Pasternack's commitment to developing high-efficiency solutions of high quality.

A new, digitally controlled hybrid energy storage system (HESS) can double the service life of a battery and improve the temperature behaviour of the overall system, for example to support fast charging. The patented system was developed by Rutronik together with the West Saxon University of Applied Sciences in Zwickau.

LASER COMPONENTSis pleased to introduce the iC-LA and iC-LF series CMOS linear image sensors from iC-Haus.

Alliance Memory has introducednew industrial-grade 3DpSLC embedded multi-media card (eMMC) solutions for solid-state storage in consumer, industrial, and networking applications.

Würth Elektronikoffers itsWE-MXGI– a power inductor with unprecedented properties.