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AR is getting smaller to make a bigger impact
Researchers are working on makingaugmented reality(AR) systems smaller and more practical for everyday use by integrating them into standard eyewear.
Electronic Specifier at EDS 2024
Electronic Specifier recalls the recent Engineering Design Show 2024 (EDS 2024), noting the key highlights from the event.
Eco Wave Power's CEO visits new Taiwanese facility
Eco Wave Power announced the CEO of Eco Wave Power, Ms. Inna Braverman, arrived for an official site visit to the planned east coast of Taiwan facility.
TI’s new programmable logic portfolio
Texas Instruments (TI)introduced programmable logic devices (PLDs) that empower engineers to streamline their logic designs for any application.
Infineon and AWL-Electricity partner to improve wireless power
Infineon Technologies announced a partnership with Canada-based AWL-Electricity Inc., a pioneer in MHz resonant capacitive couplingpower transfer technology.
Kontron AG highlights collaboration with Qualcomm
Kontron AG is collaborating with Qualcomm Technologies, Inc., to transform Edge computing and AI.
International Cyber Expo 2024 sees 16% growth in visitors
With over 7,500 visitors from 90 countries, Nineteen Groups’International Cyber Expoat Olympia London gained 16% growth in visitors in its third edition.
Cinch unveils space-ready Micro-Ds and sockets
Cinch Connectivity Solutions, a Bel Fuse company, is launching its Dura-Conspace gradeMicro-Ds.
New STM32MP255-powered SoM from Direct Insight
Direct Insighthas launched a new TRITON-TX family SoM, the TRITON-TXMP2 based on STM32MP255, STMicro’s powerful new ARMv8 dual-core processor.
Keysight unveils 3kV high voltage wafer test system
Keysight Technologies, Inc. introduces a 4881HV High Voltage Wafer Test System, expanding itssemiconductor test portfolio.