Search results for "nordic semiconductor"
Avnet Silica, u-blox agree global partnership
Avnet Silica has forged a strategic partnership with u-blox, a global supplier of positioning and wireless communication technologies and services.
SEMI University: fast-track semiconductor skills development
Aiming to help the global semiconductor industry address its talent gap by training and upskilling workers, SEMI has announced that its SEMI University learning platform now offers online course certification programmes designed to fast-track semiconductor career development.
Honda and IBM sign semiconductor R&D MoU
Honda has announced that it and IBM have signed a Memorandum of Understanding (MoU) outlining their intent to collaborate on the long-term joint research and development of next-generation computing technologies needed to overcome challenges related to processing capability, power consumption, and design complexity for the realisation of the software-defined vehicles (SDV) of the future.
ROHM SiC and EcoGaN at PCIM Europe 2024
During this year’s PCIM Europe in Nuremberg, Germany, June 11th – 13th, ROHM will present its new power semiconductor solutions with a special focus on wide bandgap devices.
Implementing GaN in power electronics design: key factors
Here, you can find out the key factors to consider when implementing GaN in power electronics design processing, and the challenges of doing so.
ASMC 2024 opens with AI, smart manufacturing, and sustainability in focus
The 35th annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC 2024) opens with a focus on critical topics ranging from yield management and metrology to new developments in AI, smart manufacturing, and sustainability.
What is fan out wafer level packaging?
Fan out wafer level packaging (FOWLP) is an advanced semiconductor technology designed to enhance performance and miniaturise electronic devices.
UK joins EU supercomputing scheme and opens researcher funding
British researchers, businesses, and academics will have enhanced access to future supercomputer research funding from 13th May 2024 as the UK joins the European High Performance Computing Joint Undertaking (EuroHPC).
DELO offers a new adhesive for closed-cavity packaging
DELO has developed a new, reliable sealant adhesive for CMOS image sensors, which are often used in driver monitoring systems.
Indium Corporation to present at PCIM Europe
Indium Corporation experts will share their technical insight and knowledge on a variety of industry-related topics throughout PCIM Europe, June 11-13, in Nuremberg, Germany.