Search results for "microelectronics"
DDC expands space market capabilities
Data Device Corporation (DDC) has announced that it has expanded its space market capabilities and product offering with the acquisition of the Microelectronics group from Maxwell Technologies. Maxwell is aleading developer and manufacturer of innovative, cost-effective, space-qualified microelectronics solutions for satellites and spacecrafts.
Indium’s VP to chair lead free soldering workshop at ECTC
Indium Corporation’s Dr. Ning-Cheng Lee, Vice President of Technology, will chair the professional development course,Materials Considerations for Achieving High Reliability Lead-Free Soldering, at the Electronic Components and Technology Conference (ECTC), on May 31-June 3 in Las Vegas.
Gallium could work as a reversible adhesive
Some adhesives may soon have a metallic sheen and be particularly easy to unstick. Researchers at the Max Planck Institute for Intelligent Systems in Stuttgart are suggesting gallium as just such a reversible adhesive. By inducing slight changes in temperature, they can control whether a layer of gallium sticks or not. This is based on the fact that gallium transitions from a solid state to a liquid state at around 30ºC.
CEA expands collaboration with Intel to advance cutting-edge research
The CEA (Atomic Energy Commission) and Intel are boosting their collaboration through a R&D agreement signed in Paris on Thursday 12th May. This collaboration, extended to several key areas in digital technology, will enable the two sides to develop a shared R&D programme and jointly submit research and innovation projects on a European scale, particularly as regards High Performance Computing (HPC), as part of the Horizon 2020 programme.
Electronic material restores functions after it breaks
Electronic materials have been a major stumbling block for the advance of flexible electronics because existing materials do not function well after breaking and healing. A new electronic material created by an international team, however, can heal all its functions automatically even after breaking multiple times. This material could improve the durability of wearable electronics.
Nordson ASYMTEK at SMT Hybrid Packaging
Nordson ASYMTEK is to present a triple-valve, closed-loop system to jet conformal coating, a UV oven to cure it, and an automated coating inspection system to verify the coating results in the SmartTec stand at SMT Hybrid Packaging.
Sensor processor node enables intelligent sensing
The IoT describes devices and applications that gather and distribute data for everyday life. Sensor devices and processes that will underpin the IoT need to be small, versatile and energy efficient. Now A*STAR researchers have developed a sensor processor node that is capable of intelligent sensing while using ultra-low levels of power. IoT applications range from biomedical signal processing to uses in vehicle-status monitoring and environmenta...
Organic lasers are integrated into silicon photonic chip
Scientists succeeded in integrating a laser with an organic gain medium on a silicon photonic chip. This approach is of enormous potential for low-cost biosensors that might be used for near-patient diagnosis once and without any sterilisation expenditure similar to today's strips for measuring blood sugar. The researchers now present the new laser in Nature Communications.
Compact photonic sensors can provide accurate readings
Researchers at A*STAR are developing compact silicon photonic sensors that can provide accurate readings without being damaged by the toxic, corrosive or even explosive conditions within the machines. The expanding field of silicon photonics uses structures called waveguides to confine electromagnetic waves to one or two dimensions, so that the wave will change in response to external factors.
Indium's VP of Technology to host soldering Webtorials
Dr. Lee’swebtorial,Low-Temperature Solders: New Developments and Applications, will cover varieties of low-temperature solders with emphasis on lead-free alloys, their physical, mechanical, and soldering properties, and their applications. It will take place from1-2 p.m. on May 17 and 19.