Search results for "igbt"
Meeting the power requirements of tomorrow at IP Expo Europe
Power protection company, Riello UPS, unveiled two new forward-thinking solutions at IP Expo Europe.Next Energy and Sentinel Dual, both of which are for use in mission critical applications, have been showcased to key decision makers looking to find out how the latest IT innovations can drive their business forward.The Next Energy UPS device is a high-tech solution designed to meet the power requirements of tomorrow, offering high efficiency of u...
Taking a step towards the IGBT industry
IXYS acquisition by Littelfuse hasturned the IGBT landscape upside down. This has initiated a new process towards market consolidation, a trend identified byYole Développement’sanalysts in their latest report,IGBT Market & Technology Trends 2017.
Power GaN market expected to be worth $450m by 2022
According to Dr. Ana Villamor, Technology & Market Analyst at Yole Développement (Yole): "The GaN market promises an imminent growth. 2015 and 2016 have been undoubtedly exciting years for the GaN power business. we project the explosion of the market with 84% CAGR between 2017 and 2022. The market value will so reach $450m at the end of the period.” What make the power GaN technology so promising?
High speed modules offer reduced switching losses
Supplier of module-based solutions for power electronics, Vincotech, has announced the launch of a new 1,200V sixpack family - flowPACK 1 and flowPACK 2 - featuring high-speed IGBT4 technology for reduced switching losses.These modules are a suitable fit for servo applications and line converters for elevator drives demanding switching frequencies up to 16kHz.
High current fast recovery diodes for HVDC applications
Global power and IC semiconductor company,IXYS, has announced that its wholly owned UK subsidiary, IXYS UK Westcode, launched a new range of 4,500V high current fast recovery diodes (HP-sonic FRDs) with nominal operating currents from 1,800-3,000A, to be used in conjunction with IXYS’ family of high current press-pack IGBTs.The new diodes incorporate IXYS UK’s most advanced die bonding technology, where the silicon die is bonded to a ...
IC photocouplers provide option for wide leadform
With a new wide leadform package type SO6L(LF4), Toshiba Electronics Europe has expanded its line-up of SO6L IC photocouplers. The wide leadform option is available for three high-speed IC photocouplers and five IGBT/MOSFET driver photocouplers.The new photocouplers can be directly mounted on PCB pads intended for SDIP6(F type) products. The SO6L(LF4)’s 2.3mm (max.) low profile package offers a 45% height reduction over SDIP6(F Type) and al...
Affordable, accessible SiC devices
Rethinking wafer fabrication and converter design can make SiC devices more affordable and accessible, advocate Corey Deyalsingh, Littelfuse and Sujit Banerjee, Monolith Semiconductor
DC/DC converters for next-gen SiC MOSFETs
The main challenges of driving SiC MOSFETs include high-frequency and high-voltage switching.Extreme voltage potentials between the control and power side can wear down isolation barriers and lead to failures. To meet these tough requirements, RECOM has recently introduced a new 2W DC/DC converter series specially designed to power the latest generation of SiC MOSFETs.Switching SiC MOSFETs requires turn-on and turn-off voltages atypical of other ...
IGBT modules offer increased current rating of 150A
With the introduction of the EconoPIM 3 package, Infineon Technologies has expanded its product portfolio of IGBT modules. The current rating of the module is thereby increased from 100A by 50% to 150A. The new power modules serve the growing demand for higher power density within the same footprint. Typical applications are motor controls for drives in elevators, escalators, fans or pumps.
IGBT/MOSFET gate driver comes in an eSOP package
Availability and full design support capabilities for a new single-channel IGBT/MOSFET gate driver from Power Integrations has been announced by Richardson RFPD. The SID1183K is a single-channel IGBT and MOSFET driver in an eSOP package. Galvanic isolation is provided by Power Integrations’ innovative solid insulator FluxLink technology