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VadaTech has announced the AMC705. The AMC705 is a Processor AMC (PrAMC) based on the NXP Layerscape LX2160A in a single-module, full-size AMC form factor based on the AMC.1, AMC.2 and the AMC.4 specifications. The LX2160A provides 16 Cortex- A72 cores with 8 MB platform cache and dual 64-bit memory controllers.

In a keynote speech opening the NXP Connects developer conference, NXP CEO Kurt Sievers announced a collaboration with Volkswagen centred on the electronics for electric vehicles (EVs). Volkswagen has adopted NXP’s battery management system (BMS) into its innovative MEB platform to help increase vehicle range, extend battery longevity, and enhance safety.

NXP Semiconductors and Xiaomi have announced the new Xiaomi PonPon Tile 2.0 stickers, powered by NXP’s NTAG NFC chip technology. The PonPon stickers and Xiaomi’s Mijia (Mi Home) app work with a multitude of Xiaomi Mi smart home devices, such as lighting, security cameras, alarm clocks and entertainment systems. Configuring and managing the devices is all done with a simple tap of a Xiaomi NFC-enabled smartphone.

NXP Semiconductors has announced the LPC55S16 MCU has been awarded Level 2 certifications by both the PSA Certified scheme co-developed by Arm and the GlobalPlatform Security Evaluation Standard for IoT Platforms (SESIP) using the secure protection profile for embedded processors. With fast-expanding IoT and Industrial edge applications, device security and data protection become paramount.

NXP Semiconductors has announced that it is enhancing its machine learning development environment and product portfolio. Through an investment, NXP has established an exclusive, strategic partnership with Au-Zone Technologies to expand NXP’s eIQ Machine Learning (ML) software development environment with easy-to-use ML tools and expand its offering of silicon-optimised inference engines for Edge ML.

NXP Semiconductors has announced the S32K3 microcontroller (MCU) family, the newest addition to its S32K product line. The S32K1 family, released in 2017, marked an important turning point in addressing software’s central role in automotive development.

ADLINK Technology has partnered with Altium and is now offering a fully automated SMARC carrier design process to its customers, leveraging Upverter, a web-based drag-and-drop designer tool. The Upverter tool requires minimal engineering skills, allowing customers to create their own SMARC based carrier board design within hours, and receive prototypes within weeks.

More products and resources aimed at developers of AI and IoT solutions are being introduced by distributor Mouser Electronics.

Like any emerging technology, the myths around UWB hit the headlines almost as fast as the facts, and sometimes linger on in our memories. We asked several UWB ecosystem players to weigh in on the misconceptions they see attending UWB now and in the future as the technology becomes more accessible. Let’s demystify four misunderstandings about UWB. Guest blog written byPeter Pirc, UWB Solution Manager at NXP.

NXP Semiconductors has announced that Volkswagen has adopted its Battery Management Solutions for the car maker’s MEB Electrical Vehicle Platform.