Search results for "NTT Corporation"
TDK stray-field ASIL C ready hall-effect position sensor family
TDK Corporation has introduced the Micronas fast 2D Hall-effect position sensor family HAL 302x addressing the need for stray-field robust motor position sensing as well as ISO 26262 compliant developments in automotive and industrial applications.
Indium receives innovation award for halogen-free, cleanable solder paste
Indiumhas earnedElectronics Manufacturing (EM) World's Innovation Award for SiPaste C201HF, a halogen-free, cleanable solder paste specifically formulated to accommodate fine feature printing processes, as seen with 01005 and 008004 components.
SEMI MEMS & Imaging Sensors Summit
More than 40 experts will gather on the 19th – 21st September at the SEMI MEMS & Imaging Sensors Summit to share insights into new innovation opportunities for MEMS, imaging and sensors applications and their potential to enable a smarter and more sustainable world.
Space-driven climate services to tackle environmental risks
Ten new projects will use Earth observation tools, satellite tracking, and data on population demographics, supported by artificial intelligence (AI), to produce forecasts and models that can be used by sectors ranging from agriculture and energy, to finance and insurance.
StratEdge high-temperature packaging technology
StratEdge is set to showcase its latest packaging technology for high-temperature applications at several industry conferences in April and May.
Semtech expands PerSe portfolio with new chipset
Semtech Corporation has announced the expansion of its PerSe product portfolio with the release of a new integrated circuit (IC) purpose-built for 5G mobile devices.
Indium Corporation joins European Centre for Power Electronics
Advanced materials innovator Indium Corporation is pleased to announce that the company has joined the European Centre for Power Electronics (ECPE), the industrial and research network for power electronics in Europe.
Proposed merger to create a market leader in zero-emission commercial vehicles
ElectraMeccanica, a designer and assembler of electric vehicles, and Tevva, a pioneer in electric medium- and heavy-duty commercial vehicles have announced that they have entered into a definitive arrangement agreement, pursuant to which ElectraMeccanica and Tevva have agreed to combine by way of a British Columbia statutory plan of arrangement.
Semtech launches of new chipset for 5G mobile devices
Semtech, a high-performance semiconductor, IoT systems, and Cloud connectivity service provider, announces the expansion of its PerSeproduct portfolio with the release of a new integrated circuit (IC) purpose-built for 5G mobile devices.
The In-Sight 3800 vision system for AI-based inspections
Cognex, a specialist in industrial machine vision, has released the In-Sight 3800 Vision System.