Search results for "Master Bond"
Anritsu’s participation in O-RAN global PlugFest fall 2022
Anritsu contributes to the construction of secure mobile networks via real network test scenarios.
Non-silicone, thermal gels available from Parker
The Chomerics Division of Parker Hannifin Corporation has unveiled THERM-A-GAP GEL 40NS, the next iteration in its line of silicone-free, thermally conductive gels.
Indium Corporation to participate at 3D-PEIM
Indium Corporation will feature selections from its portfolio of proven products for power electronics applications at the International Symposium on 3D Power Electronics Integration and Manufacturing (3D-PEIM), February 1-3rdin Miami, Florida.
Anritsu showcases new solutions for 5G at MWC 2023
Anritsu will show advanced solutions supporting the latest 5G standards and network deployments at Mobile World Congress (MWC) 2023 at Barcelona (February 27-March 3).
IPC give Garry McGuire, Teresa Rowe Hall of Fame award
In recognition of their extraordinary contributions to IPC and the electronics manufacturing industry, Garry McGuire, NASA and Teresa Rowe, IPC, were both inducted into the IPC Raymond E, IPC have announced. Pritchard Hall of Fame at IPC APEX EXPO 2023. IPC’s most prestigious honour, the Hall of Fame Award is given to individuals who have provided exceptional service and advancement to IPC and the electronics industry.
Rohde & Schwarz showcases mobile test solutions at MWC Barcelona 2023
Rohde & Schwarz brings insight in wireless communications testing and understanding of the entire mobile ecosystem to life at the Mobile World Congress 2023 in Barcelona. Under the motto “Test. Measure. Innovate.” the company will present its exciting and innovative portfolio of mobile and wireless communications testing solutions.
Global semiconductor packaging materials market to near $30bn by 2027
Powered by strong demand for new electronics innovations, the global semiconductor packaging materials market is expected to reach $29.8 billion by 2027, a compound annual growth rate (CAGR) of 2.7% from the $26.1 billion in revenue it logged in 2022, SEMI, TECHCET and TechSearch International announced today in their new Global Semiconductor Packaging Materials Outlook report.
TRI to exhibit at NEPCON China 2023
TRI will join NEPCON China 2023 held at Shanghai World Expo Exhibition & Convention Centre from July 19th–21st 2023. Visit booth #1J40 to experience Smart Test and Inspection Solutions in action.
SEMI North America Advisory Board welcomes new members
SEMI has announced the election of two new members to the SEMI North America Advisory Board (NAAB): Maheen Hamid, Co-Founder, CFO, and COO of Breker Verification Systems, and Michael Lercel, Senior Director of Global Strategic Marketing at ASML.
Seica SPA will show at Battery Show
From 23—25 May 2023 Seica will be presenting the latest innovative test solutions developed specifically for the EV sector at the Battery Show Europe in Stuttgart, Germany.