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Infineon QDPAK and DDPAK registered as JEDEC standard
The trends toward higher power density and cost optimisation dominate the development goals of efficient high-power applications that create substantial value for segments such as electromobility. To push these boundaries, Infineon Technologies today announced it has successfully registered its QDPAK and DDPAK top-side cooling (TSC) packages, which are ideal for high-voltage MOSFETs as a JEDEC standard.
congatec small form factor to complete high-performance ecosystem
congatec will be presenting its comprehensive COM-HPC ecosystem at embedded world 2023 (hall 3/booth 241). The portfolio now ranges from high-performance COM-HPC Server-on-Modules to ultra-compact and brand-new COM-HPC Client-on-Modules that is hardly larger than a credit card.
KEB Automation uses Yokogawa power analyser to build motor drives
Variable speed drives already offer users substantial power savings, as they reduce the power input when driving motors at less than the maximum rated load.Motor drive manufacturers are improving the performance of their devices still further by introducing faster switching capabilities. These allow motor drives to use smaller capacitors and magnetic components, saving both space and weight.
Distrelec adds electronic solutions from leading Swiss providers
Distrelec, European specialist distributor of electronics and electronic components, is boosting its Swiss credentials by adding to its product portfolio two top-quality brands from highly respected manufacturers in Switzerland.
Yokogawa power analyser used to build higher efficiency motor drives
Variable speed drives already offer users substantial power savings, as they reduce the power input when driving motors at less than the maximum rated load.
DELO develop line lamp for curing adhesives
DELO has developed a line lamp for curing adhesives and other multi-functional polymers.The lamp offers high curing speeds and great flexibility for integration into production lines, like those found in consumer electronics assembly, the company claim. It can also be used, for example, in the lamination of thin-film solar cells.
Teledyne LeCroy supports PCI Express 6.0 electrical testing
New PCI Express 6.0 and software tools support faster 64 GT/s data transfer speeds using PAM4 multi-level signalling.
New product release: 4 AA Handheld ‘S-854413’
New Age Enclosures, a specialist manufacturer of plastic electronic enclosures, announces the release of its newest handheld enclosure, the 4 AA Handheld, S-854413.
LOPEC 2023: Here are the highlights for printed electronics
LOPEC 2023, the international exhibition and conference for flexible, organic, and printed electronics, will open its doors at the ICM at Messe München 28th February to 2nd March 2023. Trade fair and conference will show how printed electronics boosts innovative strength across industries and points the way to more sustainability.
Spectral sensor IC combines UV-A, UV-B and UV-C
In stock at distributor Mouser Electronics is theAS7331 3-channel UV-A/B/C spectral sensor IC from ams OSRAM.