Search results for "IBM"
Industrial IoT platform now features Cloud capabilities
Cloud Service capabilities have been added to ILS Technology’s deviceWISE Application Enablement Platform for the industrial IoT. These capabilities help redefine the information-driven enterprise, transforming manufacturing, energy and natural resources, transportation and retail transaction management with improved connectivity, real-time data that increase performance, reliability and competitiveness within factories, remote locations an...
CES' C Space provides home for creatives & advertisers
Marketing, advertising, content and creative professionals found a home together at the International CES,at C Space. This show venue, located at ARIA, served as an exciting extension of the Brand Matters and Entertainment Matters programs at CES and helped unite the 30,000 entertainment, content, advertising/marketing and creative professionals who attend the show each year.
Register for the inaugural CES Asia
Scheduled for 25th to 27th May in Shanghai, the Consumer Electronics Association has announced that registration for the 2015 International CES Asia is now live. The inaugural event will showcase the latest products and technologies entering the Asian marketplace.
Software upgrade enables RFIC interoperability
Keysight Technologies has the latest release of its powerful Advanced Design System (ADS) software, ADS 2015. Featuring silicon RFIC interoperability with Cadence’s Virtuoso, GoldenGate-in-ADS, and a host of capabilities intended to increase design efficiency, the Keysight EEsof EDA software, ADS 2015, is changing how silicon RFIC and multi-technology module design is performed.
Seebrick wins challenge to deliver power to the poor
Team Maxwell was declared the winner of the Power Hack challenge hosted by RS Components and Allied Electronics along with the international development charity Practical Action. The two-day rapid prototyping hackathon was a major first step in a collaboration that aims to deliver affordable domestic energy via off grid power sources to poverty-stricken communities around the world.
3D layer stacking & TSV technologies set to refresh memory
According to Yole Développement, both the compute (DDR3/DDR4) and mobile varieties (LPDDR3/LPDDR4) of DDR memory will reach the end of their respective journeys soon,as the DDR interface reportedly cannot run at data rates higher than 3.2Gb/s in a traditional computermain memory environment. Several DRAM memory architectures based on 3D layer stacking and Through-Silicon-Via (TSV) have evolved to carry memory technology forward.
Accelerator platform connects FPGA to POWER8 CPU
Working together through the OpenPOWER Foundation, Altera and IBM have developed the industry’s first FPGA-based acceleration platform that coherently connects an FPGA to a POWER8 CPU leveraging IBM’s Coherent Accelerator Processor Interface (CAPI). The platform was unveiled at the SuperComputing Exhibition and Conference in New Orleans (Nov 16-21).
Avnet Memec gives IoT star billing at electronica
The Internet of Things will have its own zone on the Avnet Memec at electronica. Through live demonstrations the plan is to highlight the seamless integration of different networks, nodes, sensors and actuators into single Cloud Services and web based applications. Avnet Memec recognises the IoT world is a very broad area so it has separated the demo systems into two distinct areas.
One week to discover the UK’s most exciting tech start-ups
In just over a week 18 UK tech start-ups take the stage to pitch their ideas to the likes of Google, Qualcomm Ventures, Orange Labs, IBM and London Business Angels in the Discovering Start-ups 2014 (DS14) final. Jointly delivered by Cambridge Wireless (CW) and SETsquared, the DS14 national competition has attracted entrants from UK tech clusters and will culminate in a pitching final on the 22nd October at the Deloitte’s London offices.
CDFP MSA Releases Specifications for 400 Gbps Interoperable Hot Pluggable Modules
The CDFP Multi-Source Agreement is pleased to release specifications for the CDFP 2.0 interoperable hot pluggable modules. Designed for resource intensive applications in telecommunications, networking and enterprise computing environments, the CDFP interface enables data rates of 25 Gbps over 16 lanes for an aggregate of 400 Gbps on a single module with excellent signal integrity, thermal cooling properties, and EMI protection.