Search results for "SEMICON Europa"
Siemens introduces Innovator3D IC
Siemens Digital Industries Software announces Innovator3D IC, new software that delivers a fast, predictable path for the planning and heterogeneous integration of ASICs and chiplets using the latest and most advanced semiconductor packaging 2.5D and 3D technologies and substrates in the world.
Advanced Energy’s new impedance matching network
Advanced Energy Industries has unveiled the NavX impedance matching network with advanced algorithms and direct generator communication, enabling superior levels of precise and repeatable plasma control, critical in ‘Angstrom-Era’ fabrication.
Advanced Energy's new impedance matching network
Advanced Energy Industries has introduced the NavX impedance matching network.
Avnet appoints Rebeca Obregon Farnell President
Avnet has announced that Rebeca Obregon will assume the role of President at Farnell, an Avnet company, starting 1 July 2024.
NY Creates and CEA-Leti announce partnership
NY CREATES and CEA-Leti have announced a strategic collaboration focused on the research and co-development of magnetic memory devices, which are crucial for storing computer data.
Siemens and Intel's partnership bears fruits
Siemens Digital Industries Software announced that its continued partnership with Intel Foundry has led to the creation of a new Electronic Design Automation (EDA) product certification and anadvance in embedded multi-die interconnect bridge (EMIB) technology.
High performance and enhanced reliability for advanced packages
MacDermid Alpha Electronics Solutions unveils the MICROFAB SC-40 PLUS. This next-generation, high-purity, high-speed copper plating process is engineered forsemiconductorproduction.
SignatureIP announces early access to Cloud-based NoC design tool
SignatureIP has announced the early access release of its Cloud-based iNoCulator NoCdesign tool.
Siemens advances 3D-IC adoption with Calibre 3DThermal
Siemens Digital Industries Software has introduced Calibre 3DThermal, innovative software for thermal analysis, verification, and debugging in 3D integrated circuits (3D-ICs).
Ceva enhances Edge AI with TinyML NPUs for AIoT devices
Ceva, the pioneering licensor of silicon and software IP that enables Smart Edge devices to connect, sense, and infer data more reliably and efficiently, announces that it has extended its Ceva-NeuPro family ofEdge AINPUs with the introduction ofCeva-NeuPro-NanoNPUs.