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SEMICON Europa 2024 will gather industry experts November 12-15 at Messe München in Munich, Germany for insights into the latest innovations and trends in sustainability, mobility, healthcare, materials, packaging, fab management and workforce.

STMicroelectronics, a global semiconductor pioneer serving customers across the spectrum of electronics applications, and Qualcomm Technologies International, a subsidiary of Qualcomm Incorporated, announce a new strategic collaboration for the next generation of industrial and consumer IoT solutions augmented by edge AI.

IC Manage has announced major advances to its GDP-XL design and IP management platform.

Expo Agritech 2024 is preparing to become the major European trade fair dedicated to innovation for the agricultural sector. From 26–28 November 2024, the event will turn Malaga, Spain, into the meeting point for players in the agricultural field, who will discuss how the latest generation of machinery, irrigation and water management systems, post-harvest equipment, fertilisers, agricultural yield solutions, agro-energy, biotechnology, pla...

Nokia reaffirmed its commitment to the global Internet Exchange market as it continues to work with more than 20 Internet Exchange Providers (IXPs), including six of the world’s 10 largest based on both peak traffic and number of members.

Electronic Specifier is once again looking forward to hosting thecyber securityforum at electronica 2024 in November this year.

IBM has opened its first quantum computing center outside the US at Ehningen in Germany. It marks a significant expansion of the company’s fleet of advanced, utility-scale quantum systems available to global users via the cloud.

EUK Education – a new brand fromEngineeringUK– has launched tooffer the teaching and careers community support and resources to inspire more young people to get intoSTEMand the many diverse career paths available.

Cambridge GaN Devices (CGD), the fabless, clean-tech semiconductor company that develops energy-efficient GaN-based power devices that make greener electronics possible, is taking part in two international events aimed at increasing the resilience of the semiconductor value chain and promoting information exchange and closer coordination between governments on semiconductors.

Alphawave Semihas announced the availability of the industry's first 3nm silicon-proven Universal Chiplet Interconnect Express (UCIe) Die-to-Die (D2D) IP subsystem.