Search results for "Toshiba"
Transistor array reduces power losses by 40%
A new-generation transistor array for applications such as LED lighting and industrial, high-voltage signal transmitters has been launched byToshiba Electronics Europe. The TBD62089APG incorporates 8-bit, D-type Flip Flop circuits that support a data storage function.
Wearables, IoT on the agenda at Embedded World talks
Rutronik is hosting a Speakers’ Corner on its stand at the Embedded World 2017 exhibition in Nuremberg (March 14-16). Embedded developers can find out at talks given by Renesas and Toshiba how they can optimally integrate the new technologies from these manufacturers in their designs.
Schottky barrier diodes aid voltage boosting circuits
Toshiba Electronics Europe expanded its extensive portfolio of diodes with the addition of six low reverse-current SBDs. With a peak reverse voltage of 40V, the new CCS15F40, CUS15F40, CBS10F40, CUS10F40, CTS05F40, and CUS05F40 are suitable for voltage boosting circuits in white LED backlights and for liquid crystal displays in mobile devices like smartphones and tablet PCs.
The fastest growing HDD and SSD vendor of 2016
Toshiba Electronics Europe announces that Toshiba was the fastest growing vendor in both the worldwide $25 billion hard disk drive (HDD) segment, as well as in the $17 billion solid state drive (SSD) segment in 2016 over 2015, as measured by revenue and units. These accolades were recognised in two recent IDC reports: “Worldwide Solid State Storage Quarterly Update, CY 4Q16” and “Worldwide 4Q16 HDD Shipment Results and Four-Quar...
Toshiba starts construction of Fab 6 at Yokkaichi
Toshiba announced that it has started construction of a new state-of-the-art semiconductor fabrication facility, Fab 6, and a new R&D centre, the Memory R&D Center, at Yokkaichi Operations in Mie prefecture, Japan, the company’s main memory production base.Fab 6 will be dedicated to production of BiCS FLASH, Toshiba’s innovative 3D Flash memory.
Bluetooth Smart ICs attain low current consumption
Toshiba has introduced three ICs, TC35678FSG, TC35678FXG and TS35679FSG, which support Bluetooth Low Energy (BLE) version 4.1 communications. They achieve low current consumption and are suitable for use in Bluetooth Smart devices, such as wearable technology, medical equipment, smartphone accessories, remote controls and a wide variety of emerging IoT solutions.
N-channel MOSFETs reduce heat dissipation by 40%
Two N-channel MOSFETs for load switches in mobile devices are claimed to deliver class-leading low on-resistance, according to Toshiba Electronics Europe.
Products integrate NAND chips to manage basic control functions
The launch of JEDEC e∙MMC Version 5.1 compliant embedded NAND flash memory products has been announced by Toshiba Corporation’s Storage and Electronic Devices Solutions Company, with an enhanced operational temperature range of -40 to 105°C.
Embedded NAND flash memory products for automotive applications
The launch of Toshiba Corporation’s Storage & Electronic Devices Solutions's JEDEC e∙MMCTM Version 5.1 compliant embedded NAND flash memory products supporting AEC-Q100 Grade2 requirements has been announced. The line-up offers densities of 8, 16, 32 and 64GB. Sample shipments have already started with mass production scheduled for the second quarter (April-June) of 2017.
China’s MIC 2025 results for ICs predicted to fall short
The newly released 20thanniversary edition ofThe McClean Reportcontains an analysis of the three phases of China’s attempt to gain a stronger presence in the IC industry (Figure 1). The analysis of phase three includes a long list of the successes and setbacks that the Chinese have faced since initiating this strategy in 2014.